Some factors affecting porosity in directed energy deposition of AlMgScZr-alloys von Zhao, Tong, Wang, Yuhan, Xu, Tianshan, Bakir, Maha, Cai, Wangcan, Wang, Mengjie, Dahmen, Marius, Zheng, Qihong, Wei, Xianke, Hong, Chen, Zhong, Chongliang, Albus, Patrick, Schopphoven, Thomas, Gasser, Andres, Häfner, Constantin Leon

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Laser metal deposition for additive manufacturing of AA5024 and nanoparticulate TiC modified AA5024 alloy composites prepared with balling milling process von Zhao, Tong, Dahmen, Marius, Cai, Wangcan, Alkhayat, Moritz, Schaible, Jonathan, Albus, Patrick, Zhong, Chongliang, Hong, Chen, Biermann, Tim, Zhang, Han, Gu, Dongdong, Weisheit, Andreas, Gasser, Andres, Schleifenbaum, Johannes Henrich

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Laser Directed Energy Deposition of an AlMgScZr-Alloy in High-Speed Process Regimes von Zhao, Tong, Chen, Teng, Wang, Yuhan, Wang, Mengjie, Bakir, Maha, Dahmen, Marius, Cai, Wangcan, Hong, Chen, Schopphoven, Thomas, Pirch, Norbert, Brucki, Matthias, Gasser, Andres, Häfner, Constantin Leon

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Ageing response of an Al-Mg-Mn-Sc-Zr alloy processed by laser metal deposition in thin-wall structures von Zhao, Tong, Cai, Wangcan, Dahmen, Marius, Schaible, Jonathan, Hong, Chen, Gasser, Andres, Weisheit, Andreas, Biermann, Tim, Kelbassa, Ingomar, Zhang, Han, Gu, Dongdong, Schleifenbaum, Johannes Henrich

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HIGH-PRECISION MULTILAYER CIRCUIT BOARD AND 3D PRINTING PREPARATION METHOD THEREFOR von ZHOU, Nanjia, LI, Saifeng, CAI, Wangcan

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HIGH-PRECISION MULTILAYER CIRCUIT BOARD AND 3D PRINTING PREPARATION METHOD THEREFOR von ZHOU, Nanjia, LI, Saifeng, CAI, Wangcan

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Manufacturing method of metal stand column in high-precision multilayer circuit board von CAI WANGCAN, ZHOU NANJIA

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Curing method in preparation process of high-precision multilayer circuit board von CAI WANGCAN, ZHOU NANJIA

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Method for improving discharging stability of dispensing head and application von CAO HANGCHAO, CAI WANGCAN, CHEN XIAOPENG

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Some factors affecting porosity in directed energy deposition of AlMgScZr-alloys von Zhao, Tong, Wang, Yuhan, Xu, Tianshan, Bakir, Maha, Cai, Wangcan, Wang, Mengjie, Dahmen, Marius, Zheng, Qihong, Wei, Xianke, Hong, Chen, Zhong, Chongliang, Albus, Patrick, Schopphoven, Thomas, Gasser, Andres, Häfner, Constantin Leon

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Chip packaging structure and preparation method thereof von WANG AOQI, HAN DONGSHENG, CAI WANGCAN, ZHOU NANJIA, LAO JIAJUN

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Laser metal deposition for additive manufacturing of AA5024 and nanoparticulate TiC modified AA5024 alloy composites prepared with balling milling process von Zhao, Tong, Dahmen, Marius, Cai, Wangcan, Alkhayat, Moritz, Schaible, Jonathan, Albus, Patrick, Zhong, Chongliang, Hong, Chen, Biermann, Tim, Zhang, Han, Gu, Dongdong, Weisheit, Andreas, Gasser, Andres, Schleifenbaum, Johannes Henrich

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Film pattern forming method von WU QI, HAN DONGSHENG, CAI WANGCAN

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고정밀 다층 회로 기판 및 이의 3D 프린팅 제조 방법 von CAI WANGCAN, ZHOU NANJIA, LI SAIFENG

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HIGH-PRECISION MULTILAYER CIRCUIT BOARD AND 3D PRINTING PREPARATION METHOD THEREFOR von ZHOU, Nanjia, LI, Saifeng, CAI, Wangcan

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Conformal shielding packaging structure, manufacturing method and device von WU QI, CAI WANGCAN, ZHOU NANJIA, GUAN CHUYUN

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High-precision multilayer circuit board and 3D printing preparation method thereof von CAI WANGCAN, ZHOU NANJIA, LI SAIFENG

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Hot-melting direct-writing heating system and metal melting direct-writing forming method von LOU XIAOJIE, YAN GUOWEN, CAI WANGCAN, HUANG FEI, LI SAIFENG

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High-precision machining device based on multilayer circuit manufacturing von CAI WANGCAN, HUANG FEI, LI SAIFENG

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Conformal circuit preparation method and system for surface of workpiece with step structure and conformal circuit von WU QI, LOU XIAOJIE, CAI WANGCAN, GUAN CHUYUN

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