What you should know about the low anterior resection syndrome – Clinical recommendations from a patient perspective von van der Heijden, J.A.G., Thomas, G., Caers, F., van Dijk, W.A., Slooter, G.D., Maaskant-Braat, A.J.G.

Volltext

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

Volltext

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies von Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., Rajoo, R., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Leoni, M., Tan, L.C., Lai, Y.-S., Yeh, C.-L.

Volltext

Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency von Wong, E.H., Seah, S.K.W., Caers, J.F.J.M., Lai, Y.-S.

Volltext

Advances in the drop-impact reliability of solder joints for mobile applications von Wong, E.H., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Owens, N., Lai, Y.-S.

Volltext

Pelvic Floor Rehabilitation After Rectal Cancer Surgery: A Multicenter Randomized Clinical Trial (FORCE Trial) von van der Heijden, J A G, Kalkdijk-Dijkstra, A J, Pierie, J P E N, van Westreenen, H L, Broens, P M A, Klarenbeek, B R

Volltext

Implementation and evaluation of a screening and treatment protocol for the low anterior resection syndrome von Van Der Heijden, J., van Heinsbergen, M., Thomas, G., Caers, F., Slooter, G., Maaskant-Braat, S.

Volltext

What you should know about the low anterior resection syndrome – clinical recommendations from a patient perspective von Van Der Heijden, J., Thomas, G., Caers, F., van Dijk, W., Slooter, G., Maaskant-Braat, S.

Volltext

The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling von Zhong, Ying, Liu, Wei, Wang, Chunqing, Zhao, Xiujuan, Caers, J.F.J.M.

Volltext

Correlation studies for component level ball impact shear test and board level drop test von Wong, E.H., Rajoo, R., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Leoni, M., Eu, P.L., Lai, Y.-S., Yeh, C.-L.

Volltext

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials von Ernst, L. J, van ’t Hof, C, Yang, D. G, Kiasat, M. S, Zhang, G. Q, Bressers, H. J. L, Caers, J. F. J, den Boer, A. W. J, Janssen, J

Volltext

Pelvic floor rehabilitation to improve functional outcome and quality of life after surgery for rectal cancer: study protocol for a randomized controlled trial (FORCE trial) von Kalkdijk-Dijkstra, A. J., van der Heijden, J. A. G., van Westreenen, H. L., Broens, P. M. A., Trzpis, M., Pierie, J. P. E. N., Klarenbeek, B. R.

Volltext

A Study of Crack Propagation in Pb-Free Solder Joints von Caers, J.F.J.M., Zhao, X.J., Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., van Driel, W.D., Owens, N., Leoni, M., Tan, L.C., Eu, P.L., Yi-Shao Lai, Chang-Lin Yeh

Volltext

Characterization and modeling of static and cyclic relaxation in nonconductive adhesives von GUNAWAN, M, WONG, E. H, MHAISALKAR, S. G, DAVILA, L. T, HONG, Y. U, CAERS, J. F. J. M, TSAI, T. K

Volltext

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects von Okura, J. H, Dasgupta, A, Caers, J. F. J. M

Volltext

Stress–strain characteristics of tin-based solder alloys at medium strain rate von Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

Volltext

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion von Zhao, X. J, Zhang, G. Q, Caers, J. F. J. M, Ernst, L. J

Volltext

Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs von Farley, D., Zhou, Y., Askari, F., Al-Bassyiouni, M., Dasgupta, A., Caers, J.F.J., DeVries, J.W.C.

Volltext

Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs : Thermal, mechanical and multi-physics simulation and experiments in micro-electr... von FARLEY, D, ZHOU, Y, ASKARI, F, AL-BASSYIOUNI, M, DASGUPTA, A, CAERS, J. F. J, DEVRIES, J. W. C

Volltext

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives von Zhang, Xiaowu, Wong, E.H., Rajoo, Ranjan, Iyer, Mahadevan K., Caers, J.F.J.M., Zhao, X.J.

Volltext