The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints von Mutuku, Francis, Arfaei, Babak, Cotts, Eric J.

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The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing von Hadian, Faramarz, Panta, Sitaram, Flores, Javier, Cotts, Eric J.

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The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies von Genanu, Mohammed, Hadian, Faramarz, Owen, Randy, Cotts, Eric J.

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The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines von Rae, David F., Borgesen, Peter, Cotts, Eric J.

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Mean-field dynamics of free surface flows through obstacle arrays in a narrow passage: amendments of the Washburn model von Bogoyavlenskiy, Vladislav A., Giamis, Andrew C., Cotts, Eric J.

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Improving Copper Electrodeposition in the Microelectronics Industry von Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.

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Enthalpy Increment Measurements from 4.5 K to 350 K and the Thermodynamic Properties of the Titanium Silicide TiSi(cr) von Archer, Donald G, Kematick, Robert J, Myers, Clifford E, Agarwal, S, Cotts, Eric J

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Free surface Hele-Shaw flows around an obstacle: A random walk simulation von Bogoyavlenskiy, Vladislav A, Cotts, Eric J

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Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints von Bieler, T.R., Hairong Jiang, Lehman, L.P., Kirkpatrick, T., Cotts, E.J., Nandagopal, B.

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The heat capacities of titanium silicides Ti5Si3, TiSi and TiSi2 von AGARWAL, Shilpa, COTTS, Eric J, ZAREMBO, Sergei, KEMATICK, Robert, MYERS, Clifford

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Vaporization thermodynamics and heat capacities of Cr3Ge and Cr5Ge3 von ZAREMBO, Sergei N, MYERS, Clifford E, KEMATICK, Robert J, ZAVALIJ, Peter Y, WHITTINGHAM, M. Stanley, COTTS, Eric J

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Vaporization thermodynamics and heat capacities of Ti5Ge3 and Ti6Ge5 von Zarembo, Sergei, Kematick, Robert J., Myers, Clifford E., Cotts, Eric J.

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Enthalpy Increment Measurements from 4.5 K to 350 K and the Thermodynamic Properties of the Titanium Silicide Ti5Si3(cr) von Archer, Donald G, Filor, Daniel, Oakley, Elizabeth, Cotts, Eric J

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Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4 von PITELY, Susan, ZAVALIJ, Lubov, ZAREMBO, Sergei, COTTS, Eric J

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Enthalpy Increment Measurements from 4.5 to 350 K and the Thermodynamic Properties of Titanium Disilicide(cr) to 1700 K von Archer, Donald G, Sabella, Mel S, Stillman, Stacey E, Cotts, Eric J

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Linear coefficients of thermal expansion of Au 0.5Ni 0.5Sn 4, Au 0.75Ni 0.25Sn 4, and AuSn 4 von Pitely, Susan, Zavalij, Lubov, Zarembo, Sergei, Cotts, Eric J

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Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling von Seungbae Park, Dhakal, R., Lehman, L., Cotts, E.J.

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Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors von Fullem, T.Z., Lehman, L.P., Cotts, E.J.

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Reply to “Comment on ‘Free surface Hele-Shaw flows around an obstacle: A random walk simulation’ ” von Bogoyavlenskiy, Vladislav A., Cotts, Eric J.

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Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate von Kinyanjui, R.K., Zribi, A., Cotts, E.J.

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