Plasma-enhanced chemical vapor deposition of silicon dioxide films using tetraethoxysilane and oxygen : characterization and properties of films von PATRICK, W. J, COGIN SCHWARTZ, G, CHAPPLE-SOKOL, J. D, CARRUTHERS, R, OLSEN, K

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The effective dielectric constant of silicon dioxides deposited in the spaces between adjacent conductors von COGIN SCHWARTZ, G, YI-SHIOU HUANG, PATRICK, W. J

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Distortion of conductors formed by a lift-off process von SCHWARTZ, G. C

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Gap-fill with PECVD SiO2 using deposition/sputter etch cycles von SCHWARTZ, G. C, JOHNS, P

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