Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding von Xu, Hui, Qin, Ivy, Clauberg, Horst, Chylak, Bob, Acoff, Viola L.

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Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding von Chylak, Bob, Ling, Jamin, Clauberg, Horst, Thieme, Tom

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Nickel–palladium bond pads for copper wire bonding von Clauberg, Horst, Backus, Petra, Chylak, Bob

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New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study von Xu, Hui, Qin, Ivy, Clauberg, Horst, Chylak, Bob, Acoff, Viola L.

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Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding von Laor, Ari, Athia, Depayne, Rezvani, Alireza, Clauberg, Horst, Mayer, Michael

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Photoionization mass and photoelectron spectroscopy of radicals, carbenes, and biradicals von Blush, Joel A, Clauberg, Horst, Kohn, Daniel W, Minsek, David W, Zhang, Xu, Chen, Peter

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Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire von Qin, Ivy W., Chylak, Bob, Clauberg, Horst, Shah, Aashish, Foley, John

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Flash pyrolysis nozzle for generation of radicals in a supersonic jet expansion von Kohn, Daniel W., Clauberg, Horst, Chen, Peter

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Mass and photoelectron spectroscopy of C3H2. ΔHf of singlet carbenes deviate from additivity by their singlet-triplet gaps von CLAUBERG, H, MINSEK, D. W, CHEN, P

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Assembly Equipment Requirements for Next Generation Advanced Packaging von Chylak, Bob, Clauberg, Horst, Strothmann, Tom

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Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding von Clauberg Horst, Colosimo, Jr. Thomas J

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Dynamics of Rotational Energy Release for Dissociation of Singlet Ketene and the Singlet/Triplet Branching Ratio von Wade, Elisabeth A, Clauberg, Horst, Kim, Sang Kyu, Mellinger, Axel, Moore, C. Bradley

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SYSTEM AND METHOD FOR SOLDER SEMICONDUCTOR ELEMENTS von DEANGELIS DOMINICK A, CLAUBERG HORST, CHYLAK ROBERT N

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Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods von Clauberg, Horst, Song, Ai Jun, Tarabulski, Matthew E, Buergi, Daniel P, Wasserman, Matthew B

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Wire bonding with Pd-coated copper wire von Clauberg, Horst, Chylak, Bob, Wong, Nelson, Yeung, Johnny, Milke, Eugen

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Systems and methods for bonding semiconductor elements von Clauberg, Horst, Chylak, Robert N, DeAngelis, Dominick A

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Bonding Machines For Bonding Semiconductor Elements, Methods Of Operating Bonding Machines, And Techniques For Improving UPH On Such Bonding Machines von BUERGI, Daniel P, COLOSIMO Jr., Thomas J, WASSERMAN, Matthew B, CLAUBERG, Horst

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Photoelectron spectrum of cyclopropenylidene and weak bonds in cyclopropenyl radical von Clauberg, Horst, Chen, Peter

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Methods for ultrasonically bonding semiconductor elements von DEANGELIS, DOMINICK A, CLAUBERG, HORST, CHYLAK, ROBERT N

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SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS von DeAngelis Dominick A, Clauberg Horst, Chylak Robert N

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