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  1. 1
    TWI302350B

    TWI302350B von HSU, CHAUG LIANN, CHU, CHIH WEI, TSAY MING TSEH, PAN, WENUEH, FANN, YANG JIANN, LAI, JER SHYONG, JENG, YEAU REN, CHUBG, HSING LIAO, TSAI, MENG SHIUN, WANG, YIH-HSING

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    Patent

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  2. 2
    Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material

    Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material von HSU, CHAUG LIANN, TSAY MING TSEH, PAN, WENUEH, CHU, CHIH-WEI, JENG, YEAU REN, LAI, JER-SHYONG, CHUBG, HSING LIAO, TSAI, MENG SHIUN, WANG, YIH-HSING, FANN, YANG-JIANN

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    Patent

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