Micro-Scale Chiplets Position Control von Matei, Ion, Nelaturi, Saigopal, Chow, Eugene M., Lu, Jeng Ping, Bert, Julie A., Crawford, Lara S.

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59‐6: Directed Electrostatic Microassembly for MicroLED Display von Rupp, Bradley B., Crawford, Lara S., Lu, Jeng Ping, Plochowietz, Anne, Biegelsen, Dave, Raychaudhuri, Sourobh, Butylkov, Sergey, Wang, Yunda, Chow, Eugene M.

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Quality factors in micron- and submicron-thick cantilevers von Yasumura, K.Y., Stowe, T.D., Chow, E.M., Pfafman, T., Kenny, T.W., Stipe, B.C., Rugar, D.

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High voltage thin film transistors integrated with MEMS von Chow, Eugene M., Lu, Jeng Ping, Ho, Jackson, Shih, Chinwen, De Bruyker, Dirk, Rosa, Michel, Peeters, Eric

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Microspring Characterization and Flip-Chip Assembly Reliability von Bowen Cheng, De Bruyker, D., Chua, C., Sahasrabuddhe, K., Shubin, I., Cunningham, J. E., Ying Luo, Bohringer, K. F., Krishnamoorthy, A. V., Chow, E. M.

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METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS von Chow, Eugene M, Lu, JengPing, Raychaudhuri, Sourobh

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Method and system for mass assembly of thin-film materials von Chow, Eugene M, Lu, JengPing, Raychaudhuri, Sourobh

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Spacers formed on a substrate with etched micro-springs von Chua, Christopher L, Chow, Eugene M, Wang, Qian, Wang, Yu

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MICRO ASSEMBLER WITH FINE ANGLE CONTROL von Chow, Eugene M, Lu, JengPing, Biegelsen, David K

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Method of producing an interposer with microspring contacts von Chow, Eugene M

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Characterization of a two-dimensional cantilever array with through-wafer electrical interconnects von Chow, Eugene M., Yaralioglu, Goksen G., Quate, Calvin F., Kenny, Thomas W.

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Micro assembler with fine angle control von Chow, Eugene M, Lu, JengPing, Biegelsen, David K

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Print Head Design for Ballistic Aerosol Marking with Smooth Particulate Injection from an Array of Inlets into a Matching Array of Microchannels von Volkel, Armin R, Chow, Eugene M

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METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS von Chow, Eugene M, Lu, JengPing, Raychaudhuri, Sourobh

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Method and system for mass assembly of thin film materials von Chow, Eugene M, Lu, JengPing, Raychaudhuri, Sourobh

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SPACERS FORMED ON A SUBSTRATE WITH ETCHED MICRO-SPRINGS von Chua, Christopher L, Chow, Eugene M, Wang, Qian, Wang, Yu

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MICRO-FABRICATED, STRESS-ENGINEERED MEMBERS FORMED ON PASSIVATION LAYER OF INTEGRATED CIRCUIT von Chua, Christopher L, Chow, Eugene M, Wang, Qian

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Stressed metal probes for atomic force microscopy von Hantschel, Thomas, Chow, Eugene M., Rudolph, Dirk, Fork, David K.

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MICRO ASSEMBLER WITH FINE ANGLE CONTROL von CHOW, Eugene M, BIEGELSEN, David K, LU, JengPing

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Micro assembler with fine angle control von Chow, Eugene M, Lu, JengPing, Biegelsen, David K

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