High-performance on-chip transformers von CHONG, Kyuchul, XIE, Ya-Hong

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Low capacitance and high isolation bond pad for high-frequency RFICs von CHONG, Kyuchul, XIE, Ya-Hong

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High-performance inductors integrated on porous silicon von Kyuchul Chong, Ya-Hong Xie, Kyung-Wan Yu, Daquan Huang, Chang, M.-C.F.

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Three-dimensional substrate impedance engineering based on p-/p+ Si substrate for mixed-signal system-on-chip (SoC) von CHONG, Kyuchul, XI ZHANG, TU, King-Ning, DAQUAN HUANG, CHANG, Mau-Chung, XIE, Ya-Hong

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The promising role of porous Si in mixed-signal integrated circuit technology von Kim, Han-Su, Chong, Kyuchul, Xie, Ya-Hong

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Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits von Zhang, Xi, Xu, Chengkun, Chong, Kyuchul, Tu, King-Ning, Xie, Ya-Hong

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Three-dimensional impedance engineering for mixed-signal system-on-chip applications von Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie

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Three-dimensional impedance engineering for mixed-signal system-on-chip applications von Kyuchul Chong, Ya-Hong Xie

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Three-dimensional substrate impedance engineering based on p/sup -//p/sup +/ Si substrate for mixed-signal system-on-chip (SoC) von Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Chang, Ya-Hong Xie

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Three-dimensional substrate impedance engineering based on p/sup -//p/sup %2B/ Si substrate for mixed-signal system-on-chip (SoC) von Chong, Kyuchul, Zhang, Xi, Tu, King-Ning, Huang, Daquan, Chang, Mau-Chung, Xie, Ya-Hong

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BILAYER ENCAPSULATION OF A MEMORY CELL von Fryauf, David M, Ryan, Errol Todd, Chong, Kyuchul, Sun, Zhiguo

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The importance of distributed grounding in combination with porous Si trenches for the reduction of RF crosstalk through p/sup -/ Si substrate von Han-Su Kim, Kyuchul Chong, Ya-Hong Xie, Jenkins, K.A.

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Three-dimensional substrate impedance engineering based on p super(-)/p super(+) Si substrate for mixed-signal system-on-chip (SoC) von Chong, Kyuchul, Zhang, Xi, Tu, King-Ning, Huang, Daquan, Chang, Mau-Chung, Xie, Ya-Hong

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Study of the cross-sectional profile in selective formation of porous silicon von Kim, Han-Su, Chong, Kyuchul, Xie, Ya-Hong

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The importance of distributed grounding in combination with porous Si trenches for the reduction of RF crosstalk through p- Si substrate von Kim, Han-Su, Chong, Kyuchul, Xie, Ya-Hong, Jenkins, K A

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The importance of distributed grounding in combination with porous Si trenches for the reduction of RF crosstalk through p super(-) Si substrate von Kim, Han-Su, Chong, Kyuchul, Xie, Ya-Hong, Jenkins, KA

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Methods of forming devices including multi-portion liners von Good, Farrell M, Chong, Kyuchul, Vasilyeva, Irina, Bhat, Vishwanath, Campbell, Kyle B

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Devices including multi-portion liners von Good, Farrell M, Chong, Kyuchul, Vasilyeva, Irina, Bhat, Vishwanath, Campbell, Kyle B

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METHODS OF FORMING DEVICES INCLUDING MULTI-PORTION LINERS von Good, Farrell M, Chong, Kyuchul, Vasilyeva, Irina, Bhat, Vishwanath, Campbell, Kyle B

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DEVICES INCLUDING MULTI-PORTION LINERS von Good, Farrell M, Chong, Kyuchul, Vasilyeva, Irina, Bhat, Vishwanath, Campbell, Kyle B

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