Effect of pre-existing void in sub-30nm Cu interconnect reliability von Zungsun Choi, Tsukasa, M, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Choi, Joo-Tae Moon

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Comparison of TiN Films Deposited Using Tetrakisdimethylaminotitanium and Tetrakisdiethylaminotitanium by the Atomic Layer Deposition Method von Kim, Ju Youn, Choi, Gil Heyun, Kim, Young Do, Kim, Yangdo, Jeon, Hyeongtag

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Electromigration tests for critical stress and failure mechanism evaluation in Cu/W via/Al hybrid interconnect von Zungsun Choi, Byung-Lyul Park, Jong Myeong Lee, Gil-Heyun Choi, Hyeon-Deok Lee, Joo-Tae Moon

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Investigation of Chemical Vapor Deposition (CVD)-Derived Cobalt Silicidation for the Improvement of Contact Resistance von Kim, Hyun-Su, Yun, Jong-Ho, Moon, Kwang-Jin, Sohn, Woong-Hee, Jung, Sug-Woo, Jung, Eun-Ji, Kim, Se-Hoon, Bae, Nam-Jin, Choi, Gil-Heyun, Kim, Sung-Tae, Chung, U-In, Moon, Joo-Tae, Ryu, Byung-Il

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Formation of highly reliable Cu/low-k interconnects by using CVD Co barrier in dual damascene structures von Hye Kyung Jung, Hyun-Bae Lee, Tsukasa, Matsuda, Jung, Eunji, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Choi, Chilhee Chung

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Investigation of Ni/Co bilayer salicidation process for sub-40 nm gate technology von Jung, Eun Ji, Jung, Sug-Woo, Kim, Hyun-Su, Yun, Jong-Ho, Cheong, Seong Hwee, Kim, Byung Hee, Choi, Gil Heyun, Kim, Sung Tae, Chung, U-In, Moon, Joo Tae, Ryu, Byung Il

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Investigation of Ni/Co bilayer salicidation process for sub-40nm gate technology von Jung, Eun Ji, Jung, Sug-Woo, Kim, Hyun-Su, Yun, Jong-Ho, Cheong, Seong Hwee, Kim, Byung Hee, Choi, Gil Heyun, Kim, Sung Tae, Chung, U-In, Moon, Joo Tae, Ryu, Byung Il

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Formation of halo in Sb-InSb and Sn-Bi eutectic alloy systems von Suk, Myung-Jin, Choi, Gil-Heyun, Moon, In-Hyung

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Correlation between the coupled region boundary and interdendritic eutectic composition von Suk, Myung-Jin, Choi, Gil-Heyun, Moon, In-Hyung

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Al-Reflow Process with a “Cap-Clamp” for Sub-Micron Contact Holes von Choi, Gil-Heyun, Lee, Sang-In, Park, Chang-Soo, Park, In-Seon, Ahn, Sung-Tae, Kim, Yong-Kil, Reynolds, Reese

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Investigation of the Contact Resistance between Ti/TiN and Ru in Metal-1/Plate Contacts of Ruthenium Insulator Silicon Capacitor von Yun, Ju Young, Kim, Byung Hee, Seo, Jung Hun, Lee, Jong Myeong, Kang, Sang Bom, Choi, Gil Heyun, Chung, U In, Moon, Joo Tae

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Nonvolatile MOSFET memory based on high density WN nanocrystal layer fabricated by novel PNL (pulsed nucleation layer) method von Seung-Hyun Lim, Kyong Hee Joo, Jin-Ho Park, Sang-Woo Lee, Woong Hee Sohn, Changwon Lee, Gil Heyun Choi, In-Seok Yeo, U-In Chung, Joo Tae Moon, Byung-Il Ryu

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Determination of microstructural anisotropy in Sb-InSb eutectic by electrical resistivity measurement von Suk, Myung-Jin, Choi, Gil-Heyun, Moon, In-Hyung

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Robust porous SiOCH (k=2.5) for 28nm and beyond technology node von Janghee Lee, Sang Hoon Ahn, Insun Jung, Kyu-Hee Han, Gyeonghee Kim, Sang-Don Nam, Woo Sung Jeon, Byeong Hee Kim, Gil Heyun Choi, Siyoung Choi, Ho-Kyu Kang, Chilhee Chung

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Highly reliable interconnect technology featuring 90 nm DRAM integration von U-In Chung, Siyoung Choi, Gil-Heyun Choi

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Low damage in situ contact cleaning method by a highly dense and directional ECR plasma von PARK, I. S, YOON, M, LEE, H. D, PARK, C. S, WEE, Y. J, CHOI, G. H, OH, K. Y, LEE, S. I, LEE, M. Y

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SEMICONDUCTOR DEVICES INCLUDING DUAL DAMASCENE METALLIZATION STRUCTURES von MATSUDAT SUKASA, YUN JONG-HO, JUNG EUN-JI, CHOI GIL-HEYUN CHOI

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Characteristics of PAALD-TaN thin films derived from TAIMATA precursor for copper metallization von Jong Won Hong, Kyung In Choi, You Kyoung Lee, Sung Gun Park, Sang Woo Lee, Jong Myeong Lee, Sang Bom Kang, Gil Heyun Choi, Sung Tae Kim, U-In Chung, Joo Tae Moon

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Evaluation of adhesion and barrier properties for CVD-TaN on dual damascene copper interconnects von Jong Won Hong, Jong Myeong Lee, Kyung In Choi, Youngsu Chung, Sang Woo Lee, Gil Heyun Choi, Sung Tae Kim, U-In Chung, Tae Moon, Byung-Il Ryu

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Plasma-induced damage on sub-5 nm gate oxide by PECVD-Ti process von Hee Sook Park, Jong Myeong Lee, Sang Woo Lee, Jung Hun Seo, Kyoung Mo Koo, Hyo Bum Lee, Jae Hoon Jang, Dong Kyun Park, In Sun Park, Gil Heyun Choi, U In Chung, Joo Tae Moon

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