Matrix mechanics regulates muscle regeneration by modulating kinesin-1 activity von Chiang, Wan-Yu, Yu, Helen Wenshin, Wu, Ming-Chung, Huang, Yi-Man, Chen, Yin-Quan, Lin, Jong-Wei, Liu, Yen-Wenn, You, Li-Ru, Chiou, Arthur, Kuo, Jean-Cheng

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Solid-diffusion-facilitated cleaning of copper foil improves the quality of CVD graphene von Nguyen, Dinh-Tuan, Chiang, Wan-Yu, Su, Yen-Hsun, Hofmann, Mario, Hsieh, Ya-Ping

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Recrystallization of copper at a solid interface for improved CVD graphene growth von Hsieh, Ya-Ping, Chen, Ding-Rui, Chiang, Wan-Yu, Chen, Kai-Jyun, Hofmann, Mario

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Controlling the properties of graphene produced by electrochemical exfoliation von Hofmann, Mario, Chiang, Wan-Yu, D Nguyễn, Tuân, Hsieh, Ya-Ping

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Scalable production of graphene with tunable and stable doping by electrochemical intercalation and exfoliation von Hsieh, Ya-Ping, Chiang, Wan-Yu, Tsai, Sun-Lin, Hofmann, Mario

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Scalable production of graphene with tunable and stable doping by electrochemical intercalation and exfoliationElectronic supplementary information (ESI) available. See DOI: 10.103... von Hsieh, Ya-Ping, Chiang, Wan-Yu, Tsai, Sun-Lin, Hofmann, Mario

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Recrystallization of copper at a solid interface for improved CVD graphene growthElectronic supplementary information (ESI) available: Detailed characterization of Cu foil, graphen... von Hsieh, Ya-Ping, Chen, Ding-Rui, Chiang, Wan-Yu, Chen, Kai-Jyun, Hofmann, Mario

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Tube cutter von Chiang, Wan-Yu

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Crimping tool von Chiang, Wan-Yu

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Open-pass RJ45 modular plug crimper von Chiang, Wan-Yu

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Adjustable Wrench von Liao, Chien-Chou, Chiang, Wan-Yu, Huang, Chien-Wei

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ADJUSTABLE WRENCH von LIAO, Chien-Chou, CHIANG, Wan-Yu, HUANG, Chien-Wei

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Package structure von Cheng, Ming-Da, Lin, Wei-Hung, Hsueh, Chang-Jung, Lii, Mirng-Ji, Chiang, Wan-Yu, Huang, Hui-Min

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SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THE SAME von Cheng, Ming-Da, Hsueh, Chang-Jung, Lin, Wei-Hung, Chiang, Wan-Yu, Hsiao, Ching-Wen, Lin, Cheng-Nan

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SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND METHODS OF FORMING THE SAME von Cheng, Ming-Da, Lin, Wei-Hung, Hsueh, Chang-Jung, Chiang, Wan-Yu, Huang, Hui-Min, Zhan, Kai Jun

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PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME von Cheng, Ming-Da, Lin, Wei-Hung, Hsueh, Chang-Jung, Lii, Mirng-Ji, Chiang, Wan-Yu, Huang, Hui-Min

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Semiconductor device, semiconductor package, and methods of manufacturing the same von Cheng, Ming-Da, Hsueh, Chang-Jung, Lin, Wei-Hung, Chiang, Wan-Yu, Hsiao, Ching-Wen, Lin, Cheng-Nan

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PACKAGE STRUCTURE von Cheng, Ming-Da, Lin, Wei-Hung, Hsueh, Chang-Jung, Lii, Mirng-Ji, Chiang, Wan-Yu, Huang, Hui-Min

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Semiconductor die including stress-resistant bonding structures and methods of forming the same von Cheng, Ming-Da, Hsueh, Chang-Jung, Lin, Wei-Hung, Chiang, Wan-Yu, Huang, Hui-Min, Zhan, Kai Jun

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Package structure and method of forming the same von Cheng, Ming-Da, Lin, Wei-Hung, Hsueh, Chang-Jung, Lii, Mirng-Ji, Chiang, Wan-Yu, Huang, Hui-Min

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