Comprehensive transmission electron microscopy study on Cu–Al intermetallic compound formation at wire bond interface von Bae, In-Tae, Jung, Dae Young, Chen, William T., Chen, Scott, Chang, Jenny

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MR enterography correlates highly with colonoscopy and histology for both distal ileal and colonic Crohn's disease in 310 patients von Grand, David J, Kampalath, Vinay, Harris, Adam, Patel, Ajay, Resnick, Murray B, Machan, Jason, Beland, Michael, Chen, William T, Shah, Samir A

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Intermetallic compound formation at Cu-Al wire bond interface von Bae, In-Tae, Young Jung, Dae, Chen, William T., Du, Yong

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The heterogeneity of regional specific ventilation is unchanged following heavy exercise in athletes von Tedjasaputra, Vince, Sá, Rui Carlos, Arai, Tatsuya J, Holverda, Sebastiaan, Theilmann, Rebecca J, Chen, William T, Wagner, Peter D, Davis, Christopher K, Kim Prisk, G, Hopkins, Susan R

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Electrocardiographic Identification of Drug-Induced QT Prolongation: Assessment by Different Recording and Measurement Methods von Sarapa, Nenad, Morganroth, Joel, Couderc, Jean-Philippe, Francom, Steven F., Darpo, Borje, Fleishaker, Joseph C., McEnroe, Janet D., Chen, William T., Zareba, Wojciech, Moss, Arthur J.

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Failure mechanism of lead-free solder joints in flip chip packages von FAN ZHANG, MING LI, BALAKRISNAN, Bavani, CHEN, William T

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Spirus EndoEase: Multi-Center Experience with a New Colonoscopy Assist Device von Cantero, Daniel, Monier, Charles, Toor, Arifa, Wohlman, Robert, Gannan, Robert M, Pangtay-Tea, Jesus, Pangtay-Chio, Ileana, Jonnalagadda, Sreenivasa, Akerman, Paul A, Chen, William T, Rothstein, Richard I

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Obscure gastrointestinal hemorrhage from mesenteric varices diagnosed by video capsule endoscopy von FIX, Oren K, SIMON, Jonathan T, FARRAYE, Francis A, OVIEDO, Jaime A, PRATT, Daniel S, CHEN, William T, CAVE, David R

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Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages von Ming Li, Lee, K.Y., Olsen, D.R., Chen, W.T., Tan, B.T.C., Mhaisalkar, S.

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Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages von Gu, Yu, Nakamura, Toshio, Chen, William T, Cotterell, Brian

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Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish von Xingjia Huang, Lee, S.W.R., Ming Li, Chen, W.T.

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An optimization study of underfill dispensing volume von YewChoon Chia, HongSee Yam, Lim, S.H., Chian, K.S., Sung Yi, Chen, W.T.

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Addressing packaging challenges von Adam, J., Chi Shih Chang, Stankus, J.J., Iyer, M.K., Chen, W.T.

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Mastering Endo-Laparoscopic and Thoracoscopic Surgery: ELSA Manual von Lomanto, Davide, Chen, William Tzu-Liang, Fuentes, Marilou B, Lee-Ong, Alembert, Rose Nery, Emily, Lawenko, Michael, Sta. Clara, Eva Lourdes, Fuentes, Marilou Blancos, Tang, Siau Wei, Agarwal, Narendra

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Shanghai international consensus on diagnosis and comprehensive treatment of colorectal liver metastases (version 2019) von Ren, Li, Zhu, Dexiang, Benson, Al B., Nordlinger, Bernard, Koehne, Claus-Henning, Delaney, Conor P., Kerr, David, Lenz, Heinz-Josef, Fan, Jia, Wang, Jianping, Gu, Jin, Li, Jin, Shen, Lin, Tsarkov, Petrv, Tejpar, Sabine, Zheng, Shu, Zhang, Suzhan, Gruenberger, Thomas, Qin, Xinyu, Wang, Xishan, Zhang, Zhongtao, Poston, Graeme John, Xu, Jianmin, Zhou, Aiping, Parvaiz, Amjad, Zhu, Andrew, Eng, Cathy, Lau, Chi-wai, Song, Chun, Tang, Chung-ngai, Lynch, Craig, Wan, Desen, Loyer, Evelyne, Aucejo, Federico, Wang, Feng, Chang, George J., Chen, Gong, Yang, Guang-zhong, Choi, Gyu-Seog, Wieshmann, Hulya, Tulina, Inna, Oh, Jae Hwan, Ngu, James CY, Wang, Jaw-Yuan, Zhou, Jian, Jin, Jing, Liang, Jin-Tung, Wang, Jiping, Kwak, Jung-myun, Okuda, Junji, Lee, Kang-Young, Ding, Kefeng, Kuo, Li-Jen, Ito, Masaaki, Ohue, Masayuki, Zeng, Mengsu, Valente, Michael, Miyoshi, Norikatsu, Bianchi, Paolo Pietro, Lan, Ping, Xu, Ruihua, Cai, Sanjun, Kim, Seon-Hahn, Wang, Shan, Zeng, Shan, Ng, Simon SM, Krishnamurthi, Smitha, Fenwick, Stephen, Akiyoshi, Takashi, Liu, Tianshu, Maughan, Tim, Konishi, Tsuyoshi, Law, Wai Lun, Zhang, Wei, Sun, Weijing, Chen, William Tzu-Liang, Wang, Yajie, Wang, Yi, Yuan, Ying, Sun, Yihong, Hou, Yingyong, You, YiQian Nancy, Lee, Yoon-Suk, Yao, Yunfeng, Liu, Yunpeng, Kinugasa, Yusuke, Zhang, Zhen, Yan, Zhiping, Pan, Zhizhong, Xu, Zhongfa, Zhou, Zongguang

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MicroRNA-224 Suppresses Colorectal Cancer Cell Migration by Targeting Cdc42 von Hsu, Han-Lin, Ke, Tao-Wei, Wu, Yu-Hua, Chen, William Tzu-Liang, Cheng, Ya-Wen, Cheng, Chao-Wen

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Cellular Kinetics of Perivascular MSC Precursors von Park, Tea Soon, Chen, William C. W., Murray, Iain R., Zimmerlin, Ludovic, Lazzari, Lorenza, Huard, Johnny, Peault, Bruno

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A Panorama of Discrepancy Theory von Chen, William, Srivastav, Anand, Travaglini, Giancarlo

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An investigation into the effects of flux residues on properties of underfill materials for flip chip packages von Fan Zhang, Ming Li, Chen, W.T., Chian, K.S.

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Semiconductor device packages and stacked package assemblies including high density interconnections von Hunt, John Richard, Hung, Chih-Pin, Wang, Chen-Chao, Chen, William T

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