Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV) von Shen, Wen-Wei, Chen, Kuan-Neng

Volltext

Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC) von Hu, Han-Wen, Chen, Kuan-Neng

Volltext

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review von Panigrahy, Asisa Kumar, Chen, Kuan-Neng

Volltext

Vertical interconnects of microbumps in 3D integration von Chen, Chih, Yu, Doug, Chen, Kuan-Neng

Volltext

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu von Liu, Chien-Min, Lin, Han-Wen, Huang, Yi-Sa, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, King-Ning

Volltext

Low temperature bonding technology for 3D integration von Ko, Cheng-Ta, Chen, Kuan-Neng

Volltext

Demonstration and Electrical Performance of Cu-Cu Bonding at 150 °C With Pd Passivation von Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Chen, Kuan-Neng

Volltext

Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces von Liu, Chien-Min, Lin, Han-wen, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, K.N.

Volltext

Development of Bumpless Stacking With Bottom-Up TSV Fabrication von Lee, Shih-Wei, Chen, Kuan-Neng

Volltext

Investigation of Metal Interconnect for Wafer-Level and Sealable Miniaturized MEMS Encapsulation von Tsai, Yi-Chieh, Huang, Yi-Cheng, Huang, Yu-Ting, Hu, Han-Wen, Chen, Kuan-Neng

Volltext

Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via von Tsai, Yi-Chieh, Lee, Chia-Hsuan, Chang, Hsin-Chi, Liu, Jui-Han, Hu, Han-Wen, Ito, Hiroyuki, Kim, Young Suk, Ohba, Takayuki, Chen, Kuan-Neng

Volltext

Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review von Sang Hwui Lee, Kuan-Neng Chen, Lu, James Jian-Qiang

Volltext

Reliability of key technologies in 3D integration von Ko, Cheng-Ta, Chen, Kuan-Neng

Volltext

Novel Cu-to-Cu Bonding With Ti Passivation at 180 ^ in 3-D Integration von Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Shy, Ming-Shaw, Lin, Teu-Hua, Chen, Kou-Hua, Chiu, Chi-Tsung, Chiou, Jin-Chern, Chuang, Ching-Te, Hwang, Wei, Tong, Ho-Ming, Chen, Kuan-Neng

Volltext

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application von Yao-Jen Chang, Yu-Sheng Hsieh, Kuan-Neng Chen

Volltext

Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications von Huang, Yuan-Chiu, Hu, Han-Wen, Liu, Yun-Hsi, Hsieh, Hui-Ching, Chen, Kuan-Neng

Volltext

Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme von Chang, Yao-Jen, Ko, Cheng-Ta, Chen, Kuan-Neng

Volltext

An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem von Hu, Yu-Chen, Huang, Yu-Chieh, Huang, Po-Tsang, Wu, Shang-Lin, Chang, Hsiao-Chun, Yang, Yu-Tao, You, Yan-Huei, Chen, Jr-Ming, Huang, Yan-Yu, Lin, Yen-Han, Duann, Jeng-Ren, Chiu, Tzai-Wen, Hwang, Wei, Chuang, Ching-Te, Chiou, Jin-Chern, Chen, Kuan-Neng

Volltext

A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N von Hung, Tzu-Heng, Liu, Ping-Jung, Wang, Chiao-Yen, Chung, Tsai-Fu, Chen, Kuan-Neng

Volltext

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application von Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Hung, Tzu-Heng, Chen, Kuan-Neng

Volltext