Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies von Elsobky, M, Mahsereci, Y, Yu, Z, Richter, H, Burghartz, J. N, Keck, J, Klauk, H, Zschieschang, U

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Magnetic-Multilayered Interconnects Featuring Skin Effect Suppression von Yan Zhuang, Rejaei, B., Schellevis, H., Vroubel, M., Burghartz, J.N.

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Surface-passivated high-resistivity silicon substrates for RFICs von Rong, B., Burghartz, J.N., Nanver, L.K., Rejaei, B., van der Zwan, M.

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Analysis of an AlGaN/AlN Super-Lattice Buffer Concept for 650-V Low-Dispersion and High-Reliability GaN HEMTs von Heuken, L., Kortemeyer, M., Ottaviani, A., Schroder, M., Alomari, M., Fahle, D., Marx, M., Heuken, M., Kalisch, H., Vescan, A., Burghartz, J. N.

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A programmable energy efficient readout chip for a multiparameter highly integrated implantable biosensor system von Nawito, M, Richter, H, Stett, A, Burghartz, J N

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On the design of RF spiral inductors on silicon von Burghartz, J.N., Rejaei, B.

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Evaluation of High-Temperature High-Frequency GaN-Based LC-Oscillator Components von Ottaviani, A., Palacios, P., Zweipfennig, T., Alomari, M., Beckmann, C., Bierbusse, D., Wieben, J., Ehrler, J., Kalisch, H., Negra, R., Vescan, A., Burghartz, J. N.

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Thermal effects in suspended RF spiral inductors von Sagkol, H., Sinaga, S., Burghartz, J.N., Rejaei, B., Akhnoukh, A.

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Large area Silicon-energy filters for ion implantation von Steinbach, T., Csato, C., Krippendorf, F., Letzkus, F., Rüb, M., Burghartz, J.N.

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A new approach to determine development model parameters by employing the isotropy of the development process von Kaspar, C., Butschke, J., Irmscher, M., Martens, S., Burghartz, J.N.

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Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations von Mendes, P.M., Polyakov, A., Bartek, M., Burghartz, J.N., Correia, J.H.

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Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications von Polyakov, A, Bartek, M, Burghartz, J. N

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Substrate effects in monolithic RF transformers on silicon von Ng, K.T., Rejaei, B., Burghartz, J.N.

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Integrated tunable magnetic RF inductor von Vroubel, M., Yan Zhuang, Rejaei, B., Burghartz, J.N.

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Photoresist coating methods for the integration of novel 3-D RF microstructures von Nga Phuong Pham, Boellaard, E., Burghartz, J.N., Sarro, P.M.

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Integrated RF inductors with micro-patterned NiFe core von Zhuang, Y., Vroubel, M., Rejaei, B., Burghartz, J.N.

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Review of add-on process modules for high-frequency silicon technology von Burghartz, J.N.

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Monocrystalline thin-film waferlevel encapsulation of microsystems using porous silicon von Prümm, A., Kraft, K.-H., Gottschling, P., Ahles, M., Armbruster, S., Metz, M., Burghartz, J.N.

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High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging von POLYAKOV, A, SINAGA, S, MENDES, P. M, BARTEK, M, CORREIA, J. H, BURGHARTZ, J. N

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GHz bandstop microstrip filter using patterned Ni78Fe22 ferromagnetic film von Zhuang, Y, Rejaei, B, Boellaard, E, Vroubel, M, Burghartz, J N

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