Room-temperature ferromagnetism in Cu-doped ZnO thin films von Buchholz, D. B., Chang, R. P. H., Song, J.-Y., Ketterson, J. B.

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Detection of chemical species using ultraviolet microdisk lasers von Fang, W., Buchholz, D. B., Bailey, R. C., Hupp, J. T., Chang, R. P. H., Cao, H.

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Mechanism for the growth of multiwalled carbon-nanotubes from carbon black von Buchholz, D.B., Doherty, S.P., Chang, R.P.H.

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Solid-state synthesis of multiwalled carbon nanotubes von Doherty, S. P., Buchholz, D. B., Li, B-J., Chang, R. P. H.

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Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection applications for the optoelectronic technology consortium (OETC) von Yiu-Man Wong, Muehlner, D.J., Faudskar, C.C., Buchholz, D.B., Fishteyn, M., Brandner, J.L., Parzygnat, W.J., Morgan, R.A., Mullally, T., Leibenguth, R.E., Guth, G.D., Focht, M.W., Glogovsky, K.G., Zilko, J.L., Gates, J.V., Anthony, P.J., Tyrone, B.H., Ireland, T.J., Lewis, D.H., Smith, D.F., Nati, S.F., Lewis, D.K., Rogers, D.L., Aispain, H.A., Gowda, S.M., Walker, S.G., Kwark, Y.H., Bates, R.J.S., Kuchta, D.M., Crow, J.D.

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Extensible, Low-Chromatic-Sensitivity, All-diffractive-Optics Relay for Interconnecting Optoelectronic Device Arrays von Morrison, R L, Buchholz, D B

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Strain-Driven Mn-Reorganization in Overlithiated LixMn2O4 Epitaxial Thin-Film Electrodes von Chen, X, Vörös, M, Garcia, JC, Fister, TT, Buchholz, DB, Franklin, J, Du, Y, Droubay, TC, Feng, Z, Iddir, H, Curtiss, LA, Bedzyk, MJ, Fenter, P

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High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS von Lentine, A.L., Goossen, K.W., Walker, J.A., Chirovsky, L.M.F., D'Asaro, L.A., Hui, S.P., Tseng, B.J., Leibenguth, R.E., Cunningham, J.E., Jan, W.Y., Kuo, J.-M., Dahringer, D.W., Kossives, D.P., Bacon, D.D., Livescu, G., Morrison, R.L., Novotny, R.A., Buchholz, D.B.

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Pulsed organometallic beam epitaxy of complex oxide films von DURAY, S. J, BUCHHOLZ, D. B, SONG, S. N, RICHESON, D. S, KETTERSON, J. B, MARKS, T. J, CHANG, R. P. H

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Asynchronous transfer mode distribution network by use of an optoelectronic VLSI switching chip von Lentine, A L, Reiley, D J, Novotny, R A, Morrison, R L, Sasian, J M, Beckman, M G, Buchholz, D B, Hinterlong, S J, Cloonan, T J, Richards, G W, McCormick, F B

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Electron microscopy study of interfacial structure and reaction of Yba2Cu3O7/Y-ZrO2 films on LaAlO3 substrates von Dai, J. Y., Kaatz, F. H., Markworth, P. R., Buchholz, D. B., Liu, X., Chiou, W. A., Chang, R. P. H.

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Sputter-induced grain boundary junctions in YBa2Cu3O7− x thin films on MgO von Vuchic, B. V., Merkle, K. L., Dean, K. A., Buchholz, D. B., Chang, R. P. H., Marks, L. D.

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The mechanism of sputter-induced epitaxy modification in YBCO (001) films grown on MgO (001) substrates von Huang, Y., Vuchic, B. V., Carmody, M., Baldo, P. M., Merkle, K. L., Buchholz, D. B., Mahajan, S., Lei, J. S., Markworth, P. R., Chang, R. P. H., Marks, L. D.

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The growth of (001) YBa2Cu3O(7−δ) thin films on (001) MgO by pulsed organo—metallic beam epitaxy with controlled in-plane orientation von Buchholz, D.B., Lei, J.S., Mahajan, S., Markworth, P.R., Chang, R.P.H., Hinds, B., Marks, T.J., Huang, Y., Merkle, K.L.

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In-plane orientation control of (001)YBa2Cu3O7−δ grown on (001)MgO by pulsed organometallic beam epitaxy von Buchholz, D. B., Lei, J. S., Mahajan, S., Markworth, P. R., Chang, R. P. H., Hinds, B., Marks, T. J., Schindler, J. L., Kannewurf, C. R., Huang, Y., Merkle, K. L.

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The effect of the reactant gas on YBa2Cu3Ox film formation von Buchholz, D.B., Markworth, P.R., Belot, J.A., Marks, T.J., Chang, R.P.H.

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Broadband fiber access: A fiber-to-the-customer access architecture von Buchholz, D. Bruce, Byers, Charles C., Hinterlong, Stephen J., Huensch, George D., Morrison, Rick L., Nanke, Trent R., Runyon, James P., Yu, Hsien-Chuen

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155 Mb/s operation of a FET-SEED free-space switching network von McCormick, F.B., Lentine, A.L., Morrison, R.L., Sasian, I.M., Cloonan, T.J., Novotny, R.A., Beckman, M.G., Wojcik, M.J., Hinterlong, S.J., Buchholz, D.B.

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Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal von Kuo, J.M., Wang, Y.C., Goossen, K.W., Chirovsky, L.M.F., Hui, S.P., Tseng, B.T., Walker, J., Lentine, A.L., Leibenguth, R.E., Livescu, G., Jan, W.Y., Cunningham, J.E., D'Asaro, L.A., Ron, A., Dahringer, D., Kossives, D., Bacon, D.D., Morrison, R.L., Novotny, R.A., Buchholz, D.B., Mayo, W.E.

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Surface morphology studies of Y-Ba-Cu-oxide thin films prepared by pulsed organometallic beam epitaxy von Buchholz, D.Bruce, Duray, Steven J., Schulz, Doug L., Marks, Tobin J., Ketterson, John B., Chang, R.P.H.

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