Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips von Escher, W, Brunschwiler, T, Michel, B, Poulikakos, D

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Interlayer cooling potential in vertically integrated packages von Brunschwiler, T., Michel, B., Rothuizen, H., Kloter, U., Wunderle, B., Oppermann, H., Reichl, H.

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Hysteretic electroluminescence in organic light-emitting diodes for spin injection von SALIS, G, ALVARADO, S. F, TSCHUDY, M, BRUNSCHWILER, T, ALLENSPACH, R

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Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design von Wälchli, R., Brunschwiler, T., Michel, B., Poulikakos, D.

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Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance Electronics von Wälchli, R, Brunschwiler, T, Michel, B, Poulikakos, D

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Electrical and Thermal Characterization of an Inductor-Based ANPC-Type Buck Converter in 14 nm CMOS Technology for Microprocessor Applications von Bezerra, Pedro A. M., Krismer, Florian, Kolar, Johann W., Aljameh, Riduan K., Paredes, S., Heller, R., Brunschwiler, T., Francese, Pier A., Morf, T., Kossel, Marcel A., Braendli, M.

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On the Cooling of Electronics With Nanofluids von Escher, W., Brunschwiler, T., Shalkevich, N., Shalkevich, A., Burgi, T., Michel, B., Poulikakos, D.

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Antenna coupled far-infrared/THz detector in CMOS von MORF, T, WEISS, J, KULL, L, ROTHUIZEN, H, TOIFL, T, KOSSEL, M, MENOLFI, C, VON BUEREN, G, BRUNSCHWILER, T, SCHMATZ, M

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3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling von Sridhar, A, Vincenzi, A, Ruggiero, M, Brunschwiler, T, Atienza, D

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Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks von Brunschwiler, T, Paredes, S, Drechsler, U, Michel, B, Wunderle, B, Reichl, H

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Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces von Linderman, R. J., Brunschwiler, T., Kloter, U., Toy, H., Michel, B.

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Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures von Sabry, M. M., Coskun, A. K., Atienza, D., Rosing, T. S., Brunschwiler, T.

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Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance von Brunschwiler, T., Kloter, U., Linderman, R.J., Rothuizen, H., Michel, B.

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Polarization-independent thermooptic phase shifters in silicon-oxynitride waveguides von Offrein, B.J., Jubin, D., Koster, T., Brunschwiler, T., Horst, F., Wiesmann, D., Meijer, I., Petit, M.S., Webb, D., Germann, R., Bona, G.L.

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Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications] von Brunschwiler, T., Kloter, U., Linderman, R., Rothuizen, H., Michel, B.

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Heat-removal performance scaling of interlayer cooled chip stacks von Brunschwiler, T, Paredes, S, Drechsler, U, Michel, B, Cesar, W, Leblebici, Y, Wunderle, B, Reichl, H

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Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics von Tiwari, Manish K., Zimmermann, S., Sharma, C. S., Alfieri, F., Renfer, A., Brunschwiler, T., Meijer, I., Michel, B., Poulikakos, D.

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Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging von Goicochea, J. V., Brunschwiler, T., Zurcher, J., Wolf, H., Matsumoto, K., Michel, B.

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Antenna coupled far-infrared/THz detector in CMOS von Morf, T, Weiss, J, Kull, L, Rothuizen, H, Toifl, T, Kossel, M, Menolfi, C, von Bueren, G, Brunschwiler, T, Schmatz, M

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Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks von Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Wunderle, B., Reichl, H.

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