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  1. 1
    A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters

    A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters von Erdmann, Christophe, Lowney, Donnacha, Lynam, Adrian, Keady, Aidan, McGrath, John, Cullen, Edward, Breathnach, Daire, Keane, Denis, Lynch, Patrick, De La Torre, Marites, De La Torre, Ronnie, Peng Lim, Collins, Anthony, Farley, Brendan, Madden, Liam


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  2. 2
    6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters

    6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters von Erdmann, Christophe, Lowney, Donnacha, Lynam, Adrian, Keady, Aidan, McGrath, John, Cullen, Edward, Breathnach, Daire, Keane, Denis, Lynch, Patrick, De La Torre, Marites, De La Torre, Ronnie, Peng Lim, Collins, Anthony, Farley, Brendan, Madden, Liam


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  3. 3
    High-Speed ADCs for Wireless Base Stations

    High-Speed ADCs for Wireless Base Stations von Verbruggen, Bob, Vaz, Bruno, Erdmann, Christophe, Collins, Diarmuid, Mcgrath, John, Boumaalif, Ali, Melinn, David, Cullen, Edward, Walsh, Darragh, Morgado, Alonso, Mesadri, Conrado, Long, Brian, Pathepuram, Rajitha, De La Torre, Ronnie, Manlapat, Alvin, Karyotis, Georgios, Lynch, Patrick, Lim, Peng, Breathnach, Daire, Farley, Brendan

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