Intermetallic growth kinetics of 2N gold wire ball bonds on aluminium bond pads annealed at 175 °C von Breach, C. D.

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A brief review of selected aspects of the materials science of ball bonding von Breach, C.D., Wulff, F.W.

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What is the future of bonding wire? Will copper entirely replace gold? von Breach, C. D.

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Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization von Breach, C.D., Lee, T.K.

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Cyclic loading as an extended nanoindentation technique von Saraswati, T., Sritharan, T., Mhaisalkar, S., Breach, C.D., Wulff, F.

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New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al von Breach, C.D., Wulff, F.

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Effects of Ca on grain boundary cohesion in Au ballbonding wire von Chew, Y.H., Wong, C.C., Breach, C.D., Wulff, F., Lin, T.T., He, C.B.

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Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175 °C von BREACH, C. D, WUIFF, F

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Oxidation of bulk Au–Al intermetallics von Xu, C., Breach, C.D., Sritharan, T., Wulff, F., Mhaisalkar, S.G.

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Oxidation of Au4Al in gold ballbonds von Wulff, F., Tok, C.W., Breach, C.D.

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Effects of calcium on the mechanical properties of ultra-fine grained gold wires von Chew, Y.H., Wong, C.C., Breach, C.D., Wulff, F., Mhaisalkar, S.

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ROLE OF MACROPHAGES IN ACETAMINOPHEN (PARACETAMOL)-INDUCED HEPATOTOXICITY von GOLDIN, R. D., RATNAYAKA, I. D., BREACH, C. S., BROWN, I. N., WICKRAMASINGHE, S. N.

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An unusual mechanical failure mode in gold ballbonds at 50 μm pitch due to degradation at the Au-Au4Al interface during ageing in air at 175 °C von BREACH, C. D, WULFF, F, TOK, C. W

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Hole limited recombination in polymer light-emitting diodes von Scott, J. C., Malliaras, G. G., Chen, W. D., Breach, J.-C., Salem, J. R., Brock, P. J., Sachs, S. B., Chidsey, C. E. D.

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Intermetallic growth in gold ball bonds aged at 175°C: comparison between two 4N wires of different chemistry von Breach, C. D., Wulff, F. W.

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The effects of Ca and Pd dopants on gold bonding wire and gold rod von Saraswati, T.S., Sritharan, T., Pang, C.I., Chew, Y.H., Breach, C.D., Wulff, F., Mhaisalkar, S.G., Wong, C.C.

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Effects of calcium and palladium on mechanical properties and stored energy of hard-drawn gold bonding wire von Chew, Y.H., Wong, C.C., Breach, C.D., Wulff, F., Mhaisalkar, S.G., Pang, C.I., Saraswati

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Intermetallic growth kinetics of 2N gold wire ball bonds on aluminium bond pads annealed at 175 degree C von Breach, C D

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Doping-induced simultaneous improvement of strength and ductility in ultrafine grained gold wires von Chew, Y.H., Wong, C.C., Breach, C.D., Wulff, F., Lew, T.Y.

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Degradation of the Au4Al compound in gold ballbonds during isothermal aging in air at 175 °C von BREACH, C. D, TOK, C. W, WULFF, F, CALPITO, D

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