Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology von Moffat, Thomas P., Braun, Trevor M., Raciti, David, Josell, Daniel

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Exploring the Kinetic and Thermodynamic Relationship of Charge Transfer Reactions Used in Localized Electrodeposition and Patterning in a Scanning Bipolar Cell von Braun, Trevor M, Schwartz, Daniel T

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Filament Growth and Related Instabilities during Adsorbate Suppressed Electrodeposition von Braun, Trevor M., Osborn, William A., Moffat, Thomas P.

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A High-Throughput Structural and Electrochemical Study of Metallic Glass Formation in Ni–Ti–Al von Joress, Howie, DeCost, Brian L, Sarker, Suchismita, Braun, Trevor M, Jilani, Sidra, Smith, Ryan, Ward, Logan, Laws, Kevin J, Mehta, Apurva, Hattrick-Simpers, Jason R

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Bipolar Electrochemical Displacement: A New Phenomenon with Implications for Self-Limiting Materials Patterning von Braun, Trevor M., Schwartz, Daniel T.

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Development of an automated millifluidic platform and data-analysis pipeline for rapid electrochemical corrosion measurements: A pH study on Zn-Ni von Joress, Howie, DeCost, Brian, Hassan, Najlaa, Braun, Trevor M., Gorham, Justin M., Hattrick-Simpers, Jason

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Analytical and Computational Scaling Relationships for the Coupled Phenomena that Control Local Bipolar Electrochemical Behavior von Braun, Trevor M., Schwartz, Daniel T.

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Remote Control Electrodeposition: Principles for Bipolar Patterning of Substrates without an Electrical Connection von Braun, Trevor M., Schwartz, Daniel T.

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The Emerging Role of Electrodeposition in Additive Manufacturing von Braun, Trevor M., Schwartz, Daniel T.

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Development of an automated millifluidic platform and data-analysis pipeline for rapid electrochemical corrosion measurements: a pH study on Zn-Ni von Joress, Howie, DeCost, Brian, Hassan, Najlaa, Braun, Trevor M, Gorham, Justin M, Hattrick-Simpers, Jason

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“Wireless” Direct-Write Electrodeposition and Patterning Via Bipolar Electrochemistry von Braun, Trevor M, Schwartz, Daniel T.

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Exploiting the Spatial Homogeneity of Adlayer Breakdown on Microelectrodes to Develop a Kinetic Model for S-NDR Copper Electrodeposition von Braun, Trevor M, Moffat, Thomas P.

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Microelectrode Studies of the Critical Breakdown and Spatial Bifurcation in Additive Derived S-NDR Copper Electrodeposition von Braun, Trevor M, Moffat, Thomas P.

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Bipolar Electrodeposition: A Pathway for Direct-Write Patterning of Metals without Electrical Connections to the Substrate von Braun, Trevor M, Schwartz, Daniel T.

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Scaling Relationships for Designing Local Bipolar Electrochemical Systems von Braun, Trevor M, Schwartz, Daniel T.

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Contactless Electrodeposition and Micropatterning Via Bipolar Electrochemical Printing von Braun, Trevor M, Schwartz, D.

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Theory and Experiments for Generalization of the Scanning Bipolar Cell for Patterning of Diverse Metals von Braun, Trevor M, Schwartz, Daniel T.

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(Electrodeposition Division Research Award) The Scanning Bipolar Cell: Design Principles for Patterning of Diverse Metals without Contact to the Substrate von Braun, Trevor M, Schwartz, Daniel T.

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Development of an automated millifluidic platform and data-analysis pipeline for rapid electrochemical corrosion measurements: a pH study on Zn-Ni von Howie Joress, DeCost, Brian, Hassan, Najlaa, Braun, Trevor M, Gorham, Justin M, Hattrick-Simpers, Jason

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A high-throughput structural and electrochemical study of metallic glass formation in Ni-Ti-Al von Howie Joress, DeCost, Brian L, Sarker, Suchismita, Braun, Trevor M, Jilani, Sidra, Smith, Ryan, Ward, Logan, Laws, Kevin J, Mehta, Apurva, Hattrick-Simpers, Jason

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