Contributions to an additive method for manufacturing solderless assembly for electronics von Varzaru, G, Savu, M, Mihailescu, B, Ionescu, C, Branzei, M

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Corrosion resistance appraisal of TiN, TiCN and TiAlN coatings deposited by CAE-PVD method on WC–Co cutting tools exposed to artificial sea water von Matei, A.A., Pencea, I., Branzei, M., Trancă, D.E., Ţepeş, G., Sfăt, C.E., Ciovica (Coman), E., Gherghilescu, A.I., Stanciu, G.A.

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Phase stability and consolidation of glassy/nanostructured Al85Ni9Nd4Co2 alloys von Zhang, L.C., Calin, M., Branzei, M., Schultz, L., Eckert, J.

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Osseointegration of sputtered SiC-added hydroxyapatite for orthopaedic applications von Vranceanu, D.M., Cotrut, C.M., Bramowicz, M., Titorencu, I., Kulesza, S., Kiss, A., Berbecaru, A., Pruna, V., Branzei, M., Vladescu, A.

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The matrix effect on spectrochemical analysis accuracy of AISI 316 biomaterial grades von Pencea, I, Branzei, M, Miculescu, F, Pencea, M, Trante, O, Miculescu, M

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Fuzzy clan games and bi-monotonic allocation rules von Tijs, S.H, Brânzei, M.R, Muto, S, Ishihara, S, Fukuda, E

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Phase stability and consolidation of glassy/nanostructured Al 85 Ni 9 Nd 4 Co 2 alloys von Zhang, L.C., Calin, M., Branzei, M., Schultz, L., Eckert, J.

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Preparation and Characterisation of Biocompatible Vitroceramic-Metal Systems for Applications in Medicine von Britchi, M., Olteanu, M., Jitianu, G., Branzei, M., Gheorghe, D., Nita, P.

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Correlation between the thermophysical properties, geometry and microstructure of the SAC305 and SAC-X typical solder joints von Branzei, M., Svasta, P., Miculescu, F., Miculescu, M., Plotog, I.

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The Quantitative Characterization of Alumino-Thermic Railways Welding Joints von Branzei, M, Gheorghe, D, Bunea, D, Opferman, I

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New approach for measuring the surface tension of SnAgCu305 molten alloy von Pencea, I., Sfat, C. E., Branzei, M., Plotog, I.

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Solder joints properties as function of multiple reflow Vapor Phase Soldering process von Branzei, M., Plotog, I., Miculescu, F., Varzaru, G., Svasta, P., Thumm, A.

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Microstructure comparative analysis of the solder joints based on SAC/SN100 soldering alloy type depending on the cooling rate von Plotog, I., Dumitru, G., Codreanu, N. D., Vasile, A., Branzei, M., Pencea, I., Tarcolea, M.

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Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model von Plotog, I., Mihailescu, B., Pencea, I., Branzei, M., Svasta, P., Cucu, T., Tarcolea, M.

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PCBs thermophysical properties in lead-free assembling process assessment von Plotog, I, Branzei, M, Svasta, P, Miculescu, M, Cucu, T, Thumm, A

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Solder joints properties assessment in the terms of 4P Soldering Model von Plotog, I., Cucu, T., Mihailescu, B., Svasta, P., Branzei, M., Tarcolea, M., Miculescu, F., Thumm, A., Flechtmann, A.

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HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment von Plotog, I., Svasta, P., Villain, J., Illyefalvi-Vitez, Z., Pietrikova, A., Branzei, M., Miculescu, F., Constantinescu, D., Balan, C., Cucu, T., Varzaru, G.

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The checkpoint response to replication stress von Branzei, Dana, Foiani, Marco

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The DNA damage response during DNA replication von Branzei, Dana, Foiani, Marco

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Interplay of replication checkpoints and repair proteins at stalled replication forks von Branzei, Dana, Foiani, Marco

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