Assessing Copper High Density-TSVs for Reliable Performance in Cryogenic Systems von Moreau, Stephane, Thomas, Candice, Bouchu, David

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Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements von Moreau, S., Jourdon, J., Lhostis, S., Bouchu, D., Ayoub, B., Arnaud, L., Frémont, H.

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Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation von Thomas, Candice, Charbonnier, Jean, Garnier, Arnaud, Bresson, Nicolas, Bouchu, David, Moreau, Stephane, Gustavo, Frederic, Vinet, Maud

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Correlation Between Electromigration-Related Void Volumes and Time-to-Failure by High Resolution X-Ray Tomography and Modeling von Moreau, Stephane, Fraczkiewicz, Alexandra, Bouchu, David, Bleuet, Pierre, Cloetens, Peter, Cesar Da Silva, Julio, Manzanarez, Herve, Lorut, Frederic, Lhostis, Sandrine

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Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence von Gousseau, Simon, Moreau, Stéphane, Bouchu, David, Farcy, Alexis, Montmitonnet, Pierre, Inal, Karim, Bay, François, Zelsmann, Marc, Picard, Emmanuel, Salaun, Mathieu

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Microwave Monitoring of Atmospheric Corrosion of Interconnects von Amoah, Papa K., Veksler, Dmitry, Sunday, Christopher E., Moreau, Stéphane, Bouchu, David, Obeng, Yaw S.

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(Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements von Moreau, Stéphane, Jourdon, Joris, Lhostis, Sandrine, Bouchu, David, Ayoub, Bassel, Arnaud, Lucile, Fremont, Helene

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Test structure for characterizing metal thickness in damascene CMP technology von Toffoli, A., Maitrejean, S., Duport de Pontcharra, J., de Crecy, F., Bouchu, D., Arnaud, L., Boulanger, F.

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Failure analysis of a 2.5D stacking using μinsert technology von Nowodzinski, Antoine, Mandrillon, Vincent, Bouchu, David, Franiatte, Remi, Boutry, Herve, Bloch, Didier, Rousseau, Karine, Lionel, Chevalier

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A successful implementation of dual damascene architecture to copper TSV for 3D high density applications von El Farhane, Rebha, Assous, M, Leduc, P, Thuaire, A, Bouchu, D, Feldis, H, Sillon, N

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Enabling technologies for 3D chip stacking von Leduc, P., Di Cioccio, L., Charlet, B., Rousseau, M., Assous, M., Bouchu, D., Roule, A., Zussy, M., Gueguen, P., Roman, A., Rozeau, O., Heitzmann, M., Nieto, J.-P., Vandroux, L., Haumesser, P.-H., Quenouillere, R., Toffoli, A., Sixt, P., Maitrejean, S., Clavelier, L., Sillon, N.

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First integration of Cu TSV using die-to-wafer direct bonding and planarization von Leduc, P., Assous, M., Di Cioccio, L., Zussy, M., Signamarcheix, T., Roman, A., Rousseau, M., Verrun, S., Bally, L., Bouchu, D., Cadix, L., Farcy, A., Sillon, N.

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An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling von Di Cioccio, L., Gueguen, P., Taibi, R., Signamarcheix, T., Bally, L., Vandroux, L., Zussy, M., Verrun, S., Dechamp, J., Leduc, P., Assous, M., Bouchu, D., de Crecy, F., Chapelon, L.-L., Clavelier, L.

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Sucrose tricarboxylate by sonocatalysed TEMPO-mediated oxidation von Lemoine, Sandrine, Thomazeau, Cécile, Joannard, David, Trombotto, Stéphane, Descotes, Gérard, Bouchu, Alain, Queneau, Yves

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Sonocatalysis of the TEMPO-mediated oxidation of glucosides von Brochette-Lemoine, Sandrine, Joannard, David, Descotes, Gérard, Bouchu, Alain, Queneau, Yves

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Ultrasound in carbohydrate chemistry: sonophysical glucose oligomerisation and sonocatalysed sucrose oxidation von Brochette-Lemoine, Sandrine, Trombotto, Stéphane, Joannard, David, Descotes, Gérard, Bouchu, Alain, Queneau, Yves

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ChemInform Abstract: Sucrose Tricarboxylate by Sonocatalyzed TEMPO-Mediated Oxidation von Lemoine, Sandrine, Thomazeau, Cecile, Joannard, David, Trombotto, Stephane, Descotes, Gerard, Bouchu, Alain, Queneau, Yves

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Cu/ULK (k=2.0) integration for 45 nm node and below using an improved hybrid material with conventional BEOL processing and a late porogen removal von Jousseaume, V., Assous, M., Zenasni, A., Maitrejean, S., Remiat, B., Leduc, P., Trouve, H., Le Cornec, C., Fayolle, M., Roule, A., Ciaramella, F., Bouchu, D., David, T., Roman, A., Scevola, D., Morel, T., Rebiscoul, D., Prokopowicz, G., Jackman, M., Guedj, C., Louis, D., Gallagher, M., Passemard, G.

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