A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view von Liu, X.-Y, Liu, C.-L, Borucki, L.J

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Effect of Temperature on Pad Surface Contact Area in Chemical Mechanical Planarization von Jiao, Y., Zhuang, Y., Liao, X., Borucki, L. J., Naman, A., Philipossian, A.

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Deposition and etch processes: continuum film evolution in microelectronics von Cale, T.S., Rogers, B.R., Merchant, T.P., Borucki, L.J.

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A multiscale simulator for low pressure chemical vapor deposition von GOBBERT, M. K, MERCHANT, T. P, BORUCKI, L. J, CALE, T. S

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Defect generation and diffusion mechanisms in Al and Al–Cu von Liu, C.-L., Liu, X.-Y., Borucki, L. J.

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Ab initio investigation of C incorporation mechanisms on Si(001) von Liu, C.-L., Borucki, L. J., Merchant, T., Stoker, M., Korkin, A.

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Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process von Liao, X., Zhuang, Y., Borucki, L. J., Theng, S., Wei, X., Ashizawa, T., Philipossian, A.

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Cardiovascular responses to blockade of angiotensin and alpha-adrenergic receptors von Borucki, L. J, Levenson, D, Hollenberg, N. K

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Fluid Pressures and Pad Topography in Chemical Mechanical Polishing von Borucki, Leonard J., Ng, Sum Huan, Danyluk, Steven

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Effect of Pad Micro-Texture on Frictional Force, Removal Rate, and Wafer Topography during Copper CMP Process von Zhuang, Yun, Liao, Xiaoyan, Borucki, Leonard J., Theng, Siannie, Wei, Xiaomin, Ashizawa, Toranosuke, Philipossian, Ara

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A theory of pad conditioning for chemical-mechanical polishing von BORUCKI, Leonard J, WITELSKI, Thomas, PLEASE, Colin, KRAMER, Peter R, SCHWENDEMAN, Donald

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Multiple scale integrated modeling of deposition processes von Merchant, Tushar P, Gobbert, Matthias K, Cale, Timothy S, Borucki, Leonard J

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Topography simulation for the virtual wafer fab von Cale, Timothy S., Merchant, Tushar P., Borucki, Leonard J., Labun, Andrew H.

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The renal vasculature in early essential hypertension: evidence for a pathogenetic role von Hollenberg, N K, Borucki, L J, Adams, D F

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beta‐Adrenoceptor‐blocking agents and the kidney: effect of nadolol and propranolol on the renal circulation von Hollenberg, NK, Adams, DF, McKinstry, DN, Williams, GH, Borucki, LJ, Sullivan, JM

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Deposition and etch processes : continuum film evolution in microelectronics: Modelling and simulation in semiconductor processing von CALE, T. S, ROGERS, B. R, MERCHANT, T. P, BORUCKI, L. J

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A Note on Primes, with Arbitrary Initial or Terminal Decimal Ciphers, in Dirichlet Arithmetic Progressions von Borucki, L. J., Diaz, J. B.

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Response to saralasin and angiotensin's role in essential and renal hypertension von Hollenberg, N K, Williams, G H, Adams, D F, Moore, T, Brown, C, Borucki, L J, Leung, F, Bavli, S, Solomon, H S, Passan, D, Dluhy, R

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Defects and Diffusion in Al and Al-Cu Alloy von Liu, Xiang Yang, Liu, Chun Li, Borucki, Leonard J.

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A Note on Primes, with Arbitrary Initial or Terminal Decimal Ciphers, in Dirichlet Arithmetic Progressions von Borucki, L. J., Diaz, J. B.

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