Efficacy of petrosectomy in malignant invasion of the temporal bone von Wierzbicka, M, Kopeć, T, Szyfter, W, Buczkowska, A, Borucki, Ł

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Bovine serum albumin-catalysed cross aldol condensation: Influence of ketone structure von Ardanaz, Sebastián M., Borucki, Estefanía L., Velez Rueda, Ana J., Parisi, Gustavo, Iribarren, Adolfo M., Iglesias, Luis E.

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Structural and evolutionary analysis unveil functional adaptations in the promiscuous behavior of serum albumins von Velez Rueda, Ana Julia, Benítez, Guillermo Ignacio, Sommese, Leandro Matías, Ardanaz, Sebastián M., Borucki, Estefanía L., Palopoli, Nicolas, Iglesias, Luis E., Parisi, Gustavo

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Albumin-catalysed synthesis of flavanones von Borucki, Estefanía L., Iribarren, Adolfo M., Iglesias, Luis E.

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Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography von Sun, T., Borucki, L., Zhuang, Y., Philipossian, A.

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Characterization of copper-hydrogen peroxide film growth kinetics von DeNardis, D., Rosales-Yeomans, D., Borucki, L., Philipossian, A.

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Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMP von LI, Z, BORUCKI, L, KOSHIYAMA, I, PHIFIPOSSIAN, A

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Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models von DeNardis, D., Rosales-Yeomans, D., Borucki, L., Philipossian, A.

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A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry von DeNardis, D., Rosales-Yeomans, D., Borucki, L., Philipossian, A.

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The Shear Force Law: A Guide to Modeling CMP Removal Rates von Borucki, L., Sampurno, Y., Philipossian, A.

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Experimental and theoretical investigation of heating and convection in copper polishing von BORUCKI, L, LI, Z, PHILIPOSSIAN, A

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A new investigation of copper's role in enhancing Al–Cu interconnect electromigration resistance from an atomistic view von Liu, X.-Y, Liu, C.-L, Borucki, L.J

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Investigation of pad staining and its effect on removal rate in copper chemical mechanical planarization von Lee, H., Zhuang, Y., Borucki, L., Joh, S., O'Moore, F., Philipossian, A.

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General model for mechanical stress evolution during electromigration von Sarychev, M. E., Zhitnikov, Yu. V., Borucki, L., Liu, C.-L., Makhviladze, T. M.

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Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process von Rosales-Yeomans, D., Borucki, L., Doi, T., Lujan, L., Philipossian, A.

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B044 Selected surgical problems in cochlear implantation in children von Szyfter, W, Karlik, M, Borucki, L, Wróbel, M, Gawecki, W

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Pad-Wafer-Slurry Interface Information from Force Data von Borucki, L., Sampurno, Y., Philipossian, A.

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Effect of Temperature on Pad Surface Contact Area in Chemical Mechanical Planarization von Jiao, Y., Zhuang, Y., Liao, X., Borucki, L. J., Naman, A., Philipossian, A.

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Design and Evaluation of Pad Grooves for Copper CMP von Rosales-Yeomans, D., DeNardis, D., Borucki, L., Philipossian, A.

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A multiscale simulator for low pressure chemical vapor deposition von GOBBERT, M. K, MERCHANT, T. P, BORUCKI, L. J, CALE, T. S

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