On the root cause of Kirkendall voiding in Cu3Sn von Yin, Liang, Borgesen, Peter

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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue von Yin, Liang, Wentlent, Luke, Yang, Linlin, Arfaei, Babak, Oasaimeh, Awni, Borgesen, Peter

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Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling von Hamasha, Sa'd, Borgesen, Peter

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Hydrogen evolution and thermal treatments for removal of plating induced impurities from Ni to extend life of solder joints von Lei, Zhen, Borgesen, Peter, Dimitrov, Nikolay

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All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints von Njuki, Michael, Pasha, Abdullah Faisal, Das, Ronit, Borgesen, Peter, Dimitrov, Nikolay

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Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel von Lei, Zhen, Borgesen, Peter, Dimitrov, Nikolay

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Classifying the Dimensional Variation in Additive Manufactured Parts From Laser-Scanned Three-Dimensional Point Cloud Data Using Machine Learning Approaches von Samie Tootooni, M, Dsouza, Ashley, Donovan, Ryan, Rao, Prahalad K, Kong, Zhenyu (James), Borgesen, Peter

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Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life von Hamasha, Sa'd, Akkara, Francy, Su, Sinan, Ali, Haneen, Borgesen, Peter

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Computational Fluid Dynamics Modeling and Online Monitoring of Aerosol Jet Printing Process von Salary, Roozbeh (Ross), Lombardi, Jack P, Samie Tootooni, M, Donovan, Ryan, Rao, Prahalad K, Borgesen, Peter, Poliks, Mark D

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Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications von Alshatnawi, Firas, Alhendi, Mohammed, Abbara, El Mehdi, Sivasubramony, Rajesh, Garakani, Behnam, Enakerakpo, Emuobosan, Shaddock, David, Stoffel, Nancy, Hoel, Cathleen, Poliks, Mark D., Borgesen, Peter

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Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions von Hamasha, Sa'd, Wentlent, Luke, Borgesen, Peter

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Assessing Current‐Carrying Capacity of Aerosol Jet Printed Conductors von Alhendi, Mohammed, Sivasubramony, Rajesh S., Weerawarne, Darshana L., Iannotti, Joseph, Borgesen, Peter, Poliks, Mark D.

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Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue von Qasaimeh, Awni, Hamasha, Sa’d, Jaradat, Younis, Borgesen, Peter

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Effective Constitutive Relations for Sintered Nano Copper Joints von Thekkut, Sanoop, Sivasubramony, Rajesh Sharma, Raj, Arun, Kawana, Yuki, Assiedu, Jones, Mirpuri, Kabir, Shahane, Ninad, Thompson, Patrick, Borgesen, Peter

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Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions von Hamasha, Sa’d, Jaradat, Younis, Qasaimeh, Awni, Obaidat, Mazin, Borgesen, Peter

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Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling von Wentlent, Luke, Alghoul, Thaer M., Greene, Christopher M., Borgesen, Peter

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A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints von Borgesen, Peter, Wentlent, Luke, Hamasha, Sa’d, Khasawneh, Saif, Shirazi, Sam, Schmitz, Debora, Alghoul, Thaer, Greene, Chris, Yin, Liang

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Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling von Hamasha, Sa'd, Qasaimeh, Awni, Jaradat, Younis, Borgesen, Peter

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Early transient creep of single crystal SnAgCu solder joints von Das, Ronit, Thekkut, Sanoop, Sivasubramony, Rajesh Sharma, Alghoul, Thaer, Mahmood, Atif, Joshi, Shantanu, Arroyo, Carlos, Sharma, Gaurav, Borgesen, Peter

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Multiscale modeling of thermoelectric generators for the optimized conversion performance von Zhou, Siyi, Sammakia, Bahgat G, White, Bruce, Borgesen, Peter

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