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  1. 1
    Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps

    Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps von Lin Bu, Siowling Ho, Velez, Sorono Dexter, Lau Boon Long, Booyang Jung, Taichong Chai, Xiaowu Zhang


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  2. 2
    Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application

    Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application von SeungJae Lee, SangWon Kim, Karim, Nozad, Dunlap, Brett, BooYang Jung, KiCheol Bae, JiHeon Yu, YoungSuk Chung, ChanHa Hwang, JinYoung Kim, ChoonHeung Lee


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