Microstructural Optimization of a Zeolite Membrane for Organic Vapor Separation von Lai, Zhiping, Bonilla, Griselda, Diaz, Isabel, Nery, Jose Geraldo, Sujaoti, Khristina, Amat, Miguel A., Kokkoli, Efrosini, Terasaki, Osamu, Thompson, Robert W., Tsapatsis, Michael, Vlachos, Dionisios G.

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Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study von Lanzillo, Nicholas A., Restrepo, Oscar D., Bhosale, Prasad S., Cruz-Silva, Eduardo, Yang, Chih-Chao, Youp Kim, Byoung, Spooner, Terry, Standaert, Theodorus, Child, Craig, Bonilla, Griselda, Murali, Kota V. R. M.

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Zeolite (MFI) Crystal Morphology Control Using Organic Structure-Directing Agents von Bonilla, Griselda, Díaz, Isabel, Tsapatsis, Michael, Jeong, Hae-Kwon, Lee, Yongjae, Vlachos, Dionisios G

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Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth von Nair, Sankar, Lai, Zhiping, Nikolakis, Vladimiros, Xomeritakis, George, Bonilla, Griselda, Tsapatsis, Michael

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Simulations and experiments on the growth and microstructure of zeolite MFI films and membranes made by secondary growth von Bonilla, Griselda, Vlachos, Dionisios G, Tsapatsis, Michael

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A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film von Du, Yingjie, Xu, Tingge, Shaw, Thomas M., Liu, Xiao Hu, Bonilla, Griselda, Li, Han, Lu, Hongbing

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Creep characterization of solder bumps using nanoindentation von Du, Yingjie, Liu, Xiao Hu, Fu, Boshen, Shaw, Thomas M., Lu, Minhua, Wassick, Thomas A., Bonilla, Griselda, Lu, Hongbing

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Delayed mechanical failure of the under-bump interconnects by bump shearing von Li, Han, Shaw, Thomas M., Liu, Xiao-Hu, Bonilla, Griselda

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Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects von Borja, Juan, Plawsky, Joel L., Lu, Toh-Ming, Gill, William N., Shaw, Thomas M., Laibowitz, Robert B., Liniger, Eric G., Cohen, Stephan A., Rosenberg, Robert, Bonilla, Griselda

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Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth von Bonilla, Griselda, Tsapatsis, Michael, Vlachos, Dionisios G., Xomeritakis, George

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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects von Nguyen, Son van, Priyadarshini, Deepika, Shobha, Hosadurga k, Haigh, Thomas J, Hu, Chao-kun, Cohen, Stephan A, Liniger, Eric, Shaw, Thomas M, Adams, Edward D, Burnham, Jay, Madan, Anita, Klymko, Nancy R, Parks, Christopher, Yang, Daewon, Molis, Steven E, Lin, Y, Bonilla, Griselda, Grill, Alfred, Edelstein, Daniel, Canaperi, Donald F, Xia, Li-Qun, Reiter, Steven, Balseanu, Mihaela, Shek, Mei-Yee

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ELECTRONIC SUBSTRATE STACKING von SHAN, Lei, FRIEDMAN, Daniel, BONILLA, Griselda, KNICKERBOCKER, John

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Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications von Knickerbocker, John, Heroux, Jean Benoit, Bonilla, Griselda, Hsu, Hsiang, Liu, Neng, Ramos, Adrian Paz, Arguin, Francois, Tribodeau, Yan, Terjani, Badr, Schultz, Mark, Ganti, Raghu Kiran, Chu, Linsong, Marushima, Chinami, Taira, Yoichi, Kohara, Sayuri, Horibe, Akihiro, Mori, Hiroyuki, Numata, Hidetoshi

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Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface von Ryan, E. Todd, Martin, Jeremy, Bonilla, Griselda, Molis, Steven, Spooner, Terry, Widodo, Johnny, Kim, Jae-Hak, Liniger, Eric, Grill, Alfred, Hu, C.-K.

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Asymmetric die bonding von Tunga, Krishna R, Li, Shidong, Sakuma, Katsuyuki, Bonilla, Griselda

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Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation von Nguyen, Son V., Haigh, Thomas, Shaw, Thomas, Molis, Steven, Dziobkowski, Chet, Zahakos, C., Cohen, Steve, Shobha, Hosadurga, Liniger, E., Hu, C. K., Bonilla, Griselda, Klymko, Nancy, Grill, Alfred

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ASYMMETRIC DIE BONDING von TUNGA, Krishna, LI, Shidong, SAKUMA, Katsuyuki, BONILLA, Griselda

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Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices von Nguyen, Son V., Haigh, Thomas, Tagami, Masayoshi, Grill, Alfred, Cohen, Stephan, Shobha, Hosadurga, Hu, Chao-Kun, Adams, Ed, Liniger, Eric, Shaw, Thomas, Cheng, Tien, Yusuff, Hakeem, Xu, Yiheng, Ko, Tze-Man, Molis, Steven, Spooner, Terry, Skordas, Spyridon, Liu, Xiao Hu, Bonilla, Griselda, Edelstein, Dan

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ELECTRONIC SUBSTRATE STACKING von SHAN, Lei, FRIEDMAN, Daniel, BONILLA, Griselda, KNICKERBOCKER, John

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ELECTRONIC SUBSTRATE STACKING von Friedman, Daniel Joseph, Knickerbocker, John, Bonilla, Griselda, Shan, Lei

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