Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits von Boettinger, W.J., Johnson, C.E., Bendersky, L.A., Moon, K.-W., Williams, M.E., Stafford, G.R.

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Thermodynamics of grain boundary premelting in alloys. I. Phase-field modeling von Mishin, Y., Boettinger, W.J., Warren, J.A., McFadden, G.B.

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Solidification microstructures: recent developments, future directions von Boettinger, W.J., Coriell, S.R., Greer, A.L., Karma, A., Kurz, W., Rappaz, M., Trivedi, R.

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Effect of vacancy creation and annihilation on grain boundary motion von McFadden, G.B., Boettinger, W.J., Mishin, Y.

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Computation of the Kirkendall velocity and displacement fields in a one-dimensional binary diffusion couple with a moving interface von Boettinger, W.J, Guyer, J.E, Campbell, C.E, McFadden, G.B

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Development of a diffusion mobility database for Ni-base superalloys von Campbell, C.E, Boettinger, W.J, Kattner, U.R

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Thermodynamic calculation of the ternary TiAlNb system von Kattner, U.R, Boettinger, W.J

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A diffuse-interface model of reactive wetting with intermetallic formation von Villanueva, W., Boettinger, W.J., McFadden, G.B., Warren, J.A.

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Atomistic simulation of hillock growth von Frolov, T., Boettinger, W.J., Mishin, Y.

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Thermodynamic model of hydride formation and dissolution in spherical particles von Mishin, Y., Boettinger, W.J.

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On dendritic solidification of multicomponent alloys with unequal liquid diffusion coefficients von Rappaz, M., Boettinger, W.J.

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Prediction of dendritic growth and microsegregation patterns in a binary alloy using the phase-field method von Warren, J.A., Boettinger, W.J.

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Surface morphologies due to grooves at moving grain boundaries having stress-driven fluxes von Sekerka, R.F., Boettinger, W.J., McFadden, G.B.

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Microstructural characterization of Al-7075-T651 chips and work pieces produced by high-speed machining von Campbell, C.E., Bendersky, L.A., Boettinger, W.J., Ivester, R.

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Solidification of Ni-Re Peritectic Alloys von Boettinger, W. J., Newbury, D. E., Ritchie, N. W. M., Williams, M. E., Kattner, U. R., Lass, E. A., Moon, K.-W., Katz, M. B., Perepezko, J. H.

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Effect of phase change and solute diffusion on spreading on a dissolving substrate von Villanueva, W., Boettinger, W.J., Warren, J.A., Amberg, G.

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Combinatorial optimization of Ti/Al/Ti/Au ohmic contacts to n-GaN von Davydov, A.V., Motayed, A., Boettinger, W.J., Gates, R.S., Xue, Q. Z., Lee, H. C., Yoo, Y. K.

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Examination of Multiphase (Zr,Ti)(V,Cr,Mn,Ni)2 Ni-MH Electrode Alloys: Part I. Dendritic Solidification Structure von Boettinger, W.J., Newbury, D.E., Wang, K., Bendersky, L.A., Chiu, C., Kattner, U.R., Young, K., Chao, B.

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Prediction of solute trapping at high solidification rates using a diffuse interface phase-field theory of alloy solidification von Boettinger, W.J., Wheeler, A.A., Murray, B.T., McFadden, G.B.

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Hillock and whisker growth on Sn and SnCu electrodeposits on a substrate not forming interfacial intermetallic compounds von WILLIAMS, M. E, MOON, K.-W, BOETTINGER, W. J, JOSELL, D, DEAL, A. D

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