The effect of tungsten inclusion into nickel-phosphorus films on their thermal and barrier properties von Stepanova, L.I., Bodrykh, T.I., Sviridov, V.V.

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Electroless Ni-P and Ni-W-P films as a barrier for thermostimulated diffusion of gold into semiconductor von Stepanova, L.I., Bodrkh, T.I., Sviridov, V.V.

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