Temperature measurements of semiconductor devices - a review von Blackburn, D.L.

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IC test structures for multilayer interconnect stress determination von Smee, S.A., Gaitan, M., Novotny, D.B., Joshi, Y., Blackburn, D.L.

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Micromachined thermal radiation emitter from a commercial CMOS process von Parameswaran, M., Robinson, A.M., Blackburn, D.L., Gaitan, M., Geist, J.

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Simulating the dynamic electrothermal behavior of power electronic circuits and systems von Hefner, A.R., Blackburn, D.L.

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Semiconductor devices and circuits: smaller, faster, denser and what it all means von Blackburn, D.L.

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Emitter ballasting resistor design for, and current handling capability of AlGaAs/GaAs power heterojunction bipolar transistors von Gao, G.-B., Unlu, M.S., Morkoc, H., Blackburn, D.L.

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Foreword thermal investigations of ICs and microstructures (THERMINIC) von Blackburn, D.L., Courtois, B.

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Resistivity of nanometer-scale films and interconnects: model and simulation von Yarimbiyik, A.E., Schafft, H.A., Allen, R.A., Zaghloul, M.E., Blackburn, D.L.

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Issues in validating package compact thermal models for natural convection cooled electronic systems von Adams, V.H., Blackburn, D.L., Joshi, Y., Berning, D.W.

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Thermal component models for electro-thermal network simulations von Hefner, A.R., Blackburn, D.L.

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Thermal component models for electrothermal network simulation von Hefner, A.R., Blackburn, D.L.

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Thermal characterization of power transistors von Oettinger, F.F., Blackburn, D.L., Rubin, S.

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Status and trends in power semiconductor devices von Blackburn, D.L.

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Simulating the dynamic electro-thermal behavior of power electronic circuits and systems von Hefner, A.R., Blackburn, D.L.

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Theory and application of a nondestructive photovoltaic technique for the measurement of resistivity variations in circular semiconductor slices von Larrabee, R.D., Blackburn, D.L.

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The effect of magnetic package leads on the measurement of thermal resistance of semiconductor devices von Berning, D.W., Blackburn, D.L.

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Ionizing Radiation Effects on Power MOSFETS during High Speed Switching von Blackburn, D. L., Berning, D. W., Benedetto, J. M., Galloway, K. F.

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Issues in validating package compact thermal models for natural convection cooled electronic systems von Adams, V.H., Blackburn, D.L., Joshi, Y.K., Berning, D.W.

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Reverse-Bias Second Breakdown of High-Power Darlington Transistors von Chen, D.y., Lee, F.c., Blackburn, D.L., Berning, D.W.

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Photovoltaic technique for measuring resistivity variations of high resistivity silicon slices von Blackburn, D.L.

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