Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections von Deutsch, A., Harrer, H., Surovic, C.W., Hellner, G., Edelstein, D.C., Goldblatt, R.D., Biery, G.A., Greco, N.A., Foster, D.M., Crabbe, E., Su, L.T., Coteus, P.W.

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Integration of copper and fluorosilicate glass for 0.18 /spl mu/m interconnections von Barth, E.P., Ivers, T.H., McLaughlin, P.S., McDonald, A., Levine, E.N., Greco, S.E., Fitzsimmons, J., Melville, I., Spooner, T., DeWan, C., Chen, X., Manger, D., Nye, H., McGahay, V., Biery, G.A., Goldblatt, R.D., Chen, T.C.

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A high performance 0.13 /spl mu/m copper BEOL technology with low-k dielectric von Goldblatt, R.D., Agarwala, B., Anand, M.B., Barth, E.P., Biery, G.A., Chen, Z.G., Cohen, S., Connolly, J.B., Cowley, A., Dalton, T., Das, S.K., Davis, C.R., Deutsch, A., DeWan, C., Edelstein, D.C., Emmi, P.A., Faltermeier, C.G., Fitzsimmons, J.A., Hedrick, J., Heidenreich, J.E., Hu, C.K., Hummel, J.P., Jones, P., Kaltalioglu, E., Kastenmeier, B.E., Krishnan, M., Landers, W.F., Liniger, E., Liu, J., Lustig, N.E., Malhotra, S., Manger, D.K., McGahay, V., Mih, R., Nye, H.A., Purushothaman, S., Rathore, H.A., Seo, S.C., Shaw, T.M., Simon, A.H., Spooner, T.A., Stetter, M., Wachnik, R.A., Ryan, J.G.

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Evaluation of a high-performance storage buffer with 3D XPoint devices for the DUNE data acquisition system von Abed Abud, Adam, Biery, Kurt, Chavez, Carlos, Ding, Pengfei, Flumerfelt, Eric, Freeman, John, Lehmann Miotto, Giovanna, Roda, Marco, Rodrigues, Philip, Sipos, Roland, Thea, Alessandro, Viren, Brett

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