Bonded planar double-metal-gate NMOS transistors down to 10 nm von Vinet, M., Poiroux, T., Widiez, J., Lolivier, J., Previtali, B., Vizioz, C., Guillaumot, B., Le Tiec, Y., Besson, P., Biasse, B., Allain, F., Casse, M., Lafond, D., Hartmann, J.-M., Morand, Y., Chiaroni, J., Deleonibus, S.

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The generic nature of the Smart-Cut® process for thin film transfer von ASPAR, B, MORICEAU, H, LETERTRE, F, RAYSSAC, O, BARGE, T, MALEVILLE, C, GHYSELEN, B, JALAGUIER, E, LAGAHE, C, SOUBIE, A, BIASSE, B, PAPON, A. M, CLAVERIE, A, GRISOLIA, J, BENASSAYAG, G

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Fully depleted silicon on insulator MOSFETs on (1 1 0) surface for hybrid orientation technologies von Signamarcheix, T., Andrieu, F., Biasse, B., Cassé, M., Papon, A.-M., Nolot, E., Ghyselen, B., Faynot, O., Clavelier, L.

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New layer transfers obtained by the SmartCut process von MORICEAU, H, FOURNEL, F, SOUBIE, A, BIASSE, B, SOUSBIE, N, SARTORI, S, MICHAUD, J. F, LETERTRE, F, RAYSSAC, O, CAYREFOURCQ, I, RICHTARCH, C, DAVAL, N, ASPAR, B, AULNETTE, C, AKATSU, T, OSTERNAUD, B, GHYSELEN, B, MAZURE, C, BATAILLOU, B, BEAUMONT, A, MORALES, C, CARTIER, A. M, POCAS, S, LAGAHE, C, JALAGUIER, E

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High-frequency surface acoustic waves excited on thin-oriented LiNbO3 single-crystal layers transferred onto silicon von PASTUREAUD, Thomas, SOLAL, Marc, FRIEDT, Jean-Michel, BALLANDRAS, Sylvain, BIASSE, Béatrice, ASPAR, Bernard, BRIOT, Jean-Bernard, DANIAU, William, STEICHEN, William, LARDAT, Raphaël, LAUDE, Vincent, LAËNS, Alain

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Genetic species delineation among branching Caribbean Porites corals von Prada, C., DeBiasse, M. B., Neigel, J. E., Yednock, B., Stake, J. L., Forsman, Z. H., Baums, I. B., Hellberg, M. E.

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Crystallographic orientation engineering in silicon-on-insulator substrates von Signamarcheix, T., Biasse, B., Papon, A.-M., Nolot, E., Mazen, F., Leveneur, J., Faynot, O., Clavelier, L., Ghyselen, B.

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High-frequency surface acoustic waves excited on thin-oriented LiNbO/sub 3/ single-crystal layers transferred onto silicon von Pastureaud, T., Solal, M., Biasse, B., Aspar, B., Briot, J.-B., Daniau, W., Steichen, W., Lardat, R., Laude, V., Laens, A., Friedt, J.-M., Ballandras, S.

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Fabrication of buried corrugated waveguides by wafer direct bonding von Pelissier, S., Pandraud, G., Mure-Ravaud, A., Tishchenko, A.V., Biasse, B.

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Photoluminescence spectroscopy of direct bonded silica based wafers von Boukenter, A., Ouerdane, Y., Mure-Ravaud, A., Pandraud, G., Pelissier, S., Pigeon, F., Biasse, B.

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High-frequency surface acoustic waves excited on thin-oriented LiNbO@@d3@ single-crystal layers transferred onto silicon von Pastureaud, T, Solal, M, Biasse, B, Aspar, B, Briot, J.-B., Daniau, W, Steichen, W, Lardat, R, Laude, V, Laens, A, Friedt, J.-M., Ballandras, S

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High-frequency surface acoustic waves excited on thin-oriented LiNbO sub(3) single-crystal layers transferred onto silicon von Pastureaud, T, Solal, M, Biasse, B, Aspar, B, Briot, J-B, Daniau, W, Steichen, W, Lardat, R, Laude, V, Laens, A, Friedt, J-M, Ballandras, S

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Engineering silicon-on-insulator (SOI) substrates for hybrid orientation technologies (HOT) von Signamarcheix, T., Biasse, B., Papon, A.-M., Nolot, E., Ghyselen, B., Clavelier, L.

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Strain compensation effects on the annealing of Ge +-B +-implanted silicon von Ferreiro, A., Papon, A.M., Biasse, B.

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SIMOX-material quality in a semi-industrial production von Lamure, J.M., Margail, J., Biasse, B., Michaud, J.F., Soubie, A., Pudda, C., Gusella, F., Jaussaud, C.

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Formation of shallow P +-N junctions by dual Ge +/B + implantation von Ferreiro, A., Biasse, B., Papon, A.M., Pontcharra, J., Truche, R.

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Low-energy BF 2+ implants von Biasse, B., Cartier, A.M., Bruel, M.

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In-depth spreading resistance characterization of buried insulating layers synthesized by high dose implantation of nitrogen or oxygen ions von Spinelli, P., Biasse, B., Jaussaud, C., De Pontcharra, J., Soubie, A., Bruel, M.

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Direct metal gate 40nm planar double gate CMOS by bonding for multipurpose applications von Vinet, M., Poiroux, T., Widiez, J., Lolivier, J., Previtali, B., Vizioz, C., Guillaumot, B., Besson, P., Simon, J., Martin, F., Maitrejean, S., Holliger, P., Biasse, B., Cassé, M., Allain, F., Toffoli, A., Lafond, D., Hartmann, J.M., Truche, R., Carron, V., Laugier, F., Roman, A., Morand, Y., Renaud, D., Mouis, M., Deleonibus, S.

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Smart-Cut(R) process: an original way to obtain thin films by ion implantation von Aspar, B., Lagahe, C., Moriceau, H., Soubie, A., Jalaguier, E., Biasse, B., Papon, A., Chabli, A., Claverie, A., Grisolia, J., Benassayag, G., Barge, T., Letertre, F., Ghyselen, B.

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