Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material von Otiaba, Kenny C., Okereke, M.I., Bhatti, R.S.

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Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges von Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O., Amalu, E.H.

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Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device von Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H., Ekpu, M.

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A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits von Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C., Takyi, G.

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Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach von Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Ekpu, M.

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Aerosol precautions and airway complications: a national prospective multicentre cohort study von Ahmad, I., El‐Boghdadly, K., Ahmad, A., Ahmad, H., Aly, H., Amer, S., Applegate, R., Barnes, J., Begbey, A., Bewley, J., Bhatti, R., Blundell, N., Boles, S., Cassin‐Scott, R., Chauhan, N., Craven, R., Cushley, C., Dalmonte, E., El‐Boghdadly, K., Eshelby, S., Fisher, J., Fisher, J., Flower, L., Folley, R., Fullbrook, A., Gallop, F., Ghosh, P., Glarbo, S., Goodman, J., Gosal, A., Haroon‐Mowahed, Y., Harrogate, S., Harvey, N., Hassani, M., Hassan‐Reshat, S., Haththotuwegama, A., Heaton, T., Heselden, E., Hinds, F., Hodgetts, J., Howes, B., Hughes, C., Jamadarkhana, S., Jones, A., Jones, S., Kakad, S., Kaur, L., Kirby, J., Ko, S., Lalabekyan, B., Liddicoat, P., Littler, C., Loka, T., Lyons, M., Mak, K., Makepeace, J., May, S., McGuire, B., Meeks, D., Mew, E., Milward, J., Molyneux, M., Moore, T., Nagarajan, V., Nepal, K., Osicki, T., Patterson, G., Patwardhan, P., Pitts, W., Poncia, J., Pookayil, S., Potter, T., Poulter, S., Pramanik, I., Puranik, S., Radwan, M., Samways, A., Sandrasegaram, N., Sasi, B., Shaw, D., Shawaf, S., Shen, Y., Southern, J., Spiro, R., Stabler, R., Summons, G., Todhunter, S., Vetuz, G., Vincent, J., Violaris, A., Walton, A., Williams, A., Williams, B., Wilson, A., Wilson‐Evans, A., Winton, A., Wood, R., Woodward, A., Younie, S., Zalkapli, N.

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Family Pathology and Anorexia in the Indian Context von Chandra, Prabha S., Shah, Anisha, Shenoy, Jyothi, Kumar, Udaya, Varghese, Mathew, Bhatti, Ranbir S., Channabasavanna, S.M.

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Enhanced diabetes care to patients of south Asian ethnic origin (the United Kingdom Asian Diabetes Study): a cluster randomised controlled trial von Bellary, S, MRCP, O'Hare, JP, FRCP, Raymond, NT, MSc, Gumber, A, PhD, Mughal, S, Dip Nursing, Szczepura, A, Prof, Kumar, S, Prof, Barnett, AH, Prof

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Adrenal insufficiency secondary to inappropriate oral administration of topical exogenous steroids presenting with hypercalcaemia von Bhatti, Rahila Sarwar, Flynn, Michael D

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Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion von Mallik, S., Takyi, G., Amalu, E.H., Ekere, N.N., Bhatti, R.S., Ibhadode, Akii Okonigbon Akaehomen

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Synthesis and bronchodilatory activity of some nitrogen bridgehead compounds von Jindal, Dharam Paul, Bhatti, Ravinder Singh, Ahlawat, Seema, Gupta, Ranju

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Unheard Voices: Experiences of Families Living with HIV/AIDS in India von Krishna, V A S, Bhatti, Ranbir S, Chandra, Prabha S, Juvva, Srilatha

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High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology von Amalu, E.H., Ekere, N.N., Bhatti, R.S.

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Family Psychiatric Ward Treatment in India von BHATTI, RANBIR S., JANAKIRAMAIAH, N., CHANNABASAVANNA, S. M.

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Thermal effects of die-attach voids location and style on performance of chip level package von Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Mallik, S., Amalu, E. H., Ekpu, M.

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Effect of rectal lactulose administration with oral therapy on time to recovery from hepatic encephalopathy: a randomized study von Raza, Muhammad Abbas, Bhatti, Rahila Sarwar, Akram, Javed

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Amelioration of Salt Stress in Sugarcane （Saccharum officinarum L.） by Supplying Potassium and Silicon in Hydroponics von M. ASHRAF RAHMATULLAH R. AHMAD A. S. BHATTI M. AFZAL A. SARWAR M. A. MAQSOOD S. KANWAL

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Influence of thermal ageing on void content and shear strength for selected lead free solder die-attach von Otiaba, K. C., Raju, N., Bhatti, R. S., Mallik, S., Bernasko, P.K.

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Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device von Otiaba, K. C., Bhatti, R. S., Ekere, N. N., Ekpu, M., Adeyemi, J.

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Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application von Otiaba, K. C., Ekere, N. N., Bhatti, R. S., Mallik, S., Amalu, E. H.

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