EP-1085: Treatment of extensive scalp lesions using VMAT (RapidArc) von Aitken, A, Beyer, G.P, Smith, S, Ritchie, D

Volltext

Surface diffusion of copper on tantalum substrates by Ostwald ripening von Fillot, F., Tőkei, Zs, Beyer, G.P.

Volltext

Challenges in the implementation of low-k dielectrics in the back-end of line von Hoofman, R.J.O.M., Verheijden, G.J.A.M., Michelon, J., Iacopi, F., Travaly, Y., Baklanov, M.R., Tökei, Zs, Beyer, G.P.

Volltext

An Implantable MOSFET Dosimeter for the Measurement of Radiation Dose in Tissue During Cancer Therapy von Beyer, G.P., Mann, G.G., Pursley, J.A., Espenhahn, E.T., Fraisse, C., Godfrey, D.J., Oldham, M., Carrea, T.B., Bolick, N., Scarantino, C.W.

Volltext

Investigation of MRI Artifact Caused by an In Vivo Dosimeter (DVS® ) von Scarantino, C.W, Beyer, G.P, Coates, G.G, Rini, C

Volltext

Measurement of Delivered Dose With Electron Beam During Boost Treatment for Breast Cancer Using the DVS Implantable Dosimeter von Scarantino, C.W, Beyer, G.P, McCumber, L, Pursley, J

Volltext

Preface von Travaly, Y., Beyer, G.P.

Volltext

Electron spin resonance study of defects in low- κ oxide insulators ( κ = 2.5–2.0) von Afanas’ev, V.V., Keunen, K., Stesmans, A., Jivanescu, M., Tőkei, Zs, Baklanov, M.R., Beyer, G.P.

Volltext

Evaluating k-values for low -k materials after damascene integration: Method and results von Vereecke, B., Pantouvaki, M., Ciofi, I., Beyer, G.P., Tökei, Zs

Volltext

Barrier and seed repair performance of thin RuTa films for Cu interconnects von Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.

Volltext

188 von Scarantino, C., Prestidge, B., Anscher, M., Ferree, C., Black, R., Beyer, G.P.

Volltext

188: True in-Vivo Dosimetry in Breast and Prostate Cancer Patients: Variance Between Predicted and Measured Dose von Scarantino, C., Prestidge, B., Anscher, M., Ferree, C., Black, R., Beyer, G.P.

Volltext

A novel approach to resistivity and interconnect modeling von Travaly, Y., Bamal, M., Carbonell, L., Iacopi, F., Stucchi, M., Van Hove, M., Beyer, G.P.

Volltext

Study of void formation kinetics in Cu interconnects using local sense structures von Croes, K, Lofrano, M, Wilson, C J, Carbonell, L, Siew, Y K, Beyer, G P, Tokei, Z

Volltext

Time and temperature dependence of early stage Stress-Induced-Voiding in Cu/low-k interconnects von Croes, K., Wilson, C.J., Lofrano, M., Travaly, Y., De Roest, D., Tokei, Z., Beyer, G.P.

Volltext

Reliability challenges for copper low-k dielectrics and copper diffusion barriers von Tökei, Zs, Li, Y.-L., Beyer, G.P.

Volltext

Demonstration of a Sub-micron Damascene Cu/Low-k Mechanical Sensor to Monitor Stress in BEOL Metallization von Wilson, C.J., Croes, K., Tokei, Z., Beyer, G.P., Horsfall, A.B., O'Neill, A.G.

Volltext

The impact of scaling on interconnect reliability von Bruynseraede, C., Tokei, Z., Iacopi, F., Beyer, G.P., Michelon, J., Maex, K.

Volltext

Novel patterning shrink technique enabling sub-50 nm trench and contact integration von Demuynck, S., Tokei, Z., Zhao, C., de Marneffe, J., Struyf, H., Boullart, W., de Beeck, M.O., Carbonell, L., Heylen, N., Vaes, J., Beyer, G.P., Vanhaelemeersch, S., Sadjadi, R., Zhu, H., Cirigliano, P., Kim, J.S., Vertommen, J., Coenegrachts, B., Pavel, E., Athayde, A.

Volltext

Role of dielectric and barrier integrity in reliability of sub-100 nm copper low-k interconnects von Tokei, Z., Van Aelst, J., Waldfried, C., Escorcia, O., Roussel, P., Richard, O., Travaly, Y., Beyer, G.P., Maex, K.

Volltext