Use of novel hydrofluorocarbon and iodofluorocarbon chemistries for a high aspect ratio via etch in a high density plasma etch tool von KARECKI, S, PRUETTE, L, REIF, R, SPARKS, T, BEU, L, VARTANIAN, V

Volltext

Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool von Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Sparks, Terry, Beu, Laurie, Vartanian, Victor, Novoselov, Konstantin

Volltext

Characterization of iodoheptafluoropropane as a dielectric etchant. III. Effluent analysis von Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Vartanian, Victor, Sparks, Terry, Beu, Laurie

Volltext

Characterization of iodoheptafluoropropane as a dielectric etchant. I. Process performance evaluation von Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Vartanian, Victor, Sparks, Terry, Beu, Laurie, Novoselov, Konstantin

Volltext

Evaluation of Pentafluoroethane and 1,1-Difluoroethane for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool von Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Sparks, Terry, Beu, Laurie, Vartanian, Victor

Volltext

Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O2 and H2O as additive gases von Tonnis, Eric J., Graves, David B., Vartanian, Victor H., Beu, Laurie, Lii, Tom, Jewett, Rusty

Volltext

Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O 2 and H 2 O as additive gases von Tonnis, Eric J., Graves, David B., Vartanian, Victor H., Beu, Laurie, Lii, Tom, Jewett, Rusty

Volltext

Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O sub(2) and H sub(2)O as additive gases von Tonnis, Eric J, Graves, David B, Vartanian, Victor H, Beu, Laurie, Lii, Tom, Jewett, Rusty

Volltext

Evaluation of oxalyl fluoride for a dielectric etch application in an inductively coupled plasma etch tool von KARECKI, Simon, CHATTERJEE, Ritwik, PRUETTE, Laura, REIF, Rafael, SPARKS, Terry, BEU, Laurie, VARTANIAN, Victor, NOVOSELOV, Konstantin

Volltext

Application of design for environment concepts to the semiconductor industry von Beu, Laurie, Mendicino, Laura

Volltext

Characterization of iodoheptafluoropropane as a dielectric etchant. II. Wafer surface analysis von Karecki, Simon, Chatterjee, Ritwik, Pruette, Laura, Reif, Rafael, Vartanian, Victor, Sparks, Terry, Lee, J. J., Beu, Laurie, Miller, Charles

Volltext

Plasma abatement reduces PFC emission von Vartanian, Victor, Beu, Laurie, Lii, Tom, Graves, David

Volltext