Microchip Health Monitoring System Using the FLL Circuit von Bender, Emmanuel, Bernstein, Joseph B

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Modern Trends in Microelectronics Packaging Reliability Testing von Bender, Emmanuel, Bernstein, Joseph B, Boning, Duane S

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Reliability prediction with MTOL von Bernstein, Joseph B., Bensoussan, Alain, Bender, Emmanuel

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Mitigation of Thermal Stability Concerns in FinFET Devices von Bender, Emmanuel, Bernstein, Joseph B., Boning, Duane S.

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Reliability matrix solution to multiple mechanism prediction von Bernstein, Joseph B., Gabbay, Moti, Delly, Ofir

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Electronic circuit reliability modeling von Bernstein, Joseph B., Gurfinkel, Moshe, Li, Xiaojun, Walters, Jörg, Shapira, Yoram, Talmor, Michael

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Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast I- V Techniques von Gurfinkel, Moshe, Xiong, Hao D., Cheung, Kin P., Suehle, John S., Bernstein, Joseph B., Shapira, Yoram, Lelis, Aivars J., Habersat, Daniel, Goldsman, Neil

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Design optimization of laser-induced microbridges for low resistance interline connections in ICs von Chung, Kuan-Jung, Peckerar, Martin, Bernstein, Joseph B.

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Failure rate estimation of known failure mechanisms of electronic packages von Yang, Liyu, Bernstein, Joseph B.

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Spatial distributions of trapping centers in HfO2/SiO2 gate stack von HEH, Dawei, YOUNG, Chadwin D, BROWN, George A, HUNG, P. Y, DIEBOLD, Alain, VOGEL, Eric M, BERNSTEIN, Joseph B, BERSUKER, Gennadi

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Solder-Joint Quantitative Crack Analysis-Ohmic Resistance Approach von Gershman, I., Bernstein, J. B.

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Spatial distributions of trapping centers in HfO2∕SiO2 gate stacks von Heh, Dawei, Young, Chadwin D., Brown, George A., Hung, P. Y., Diebold, Alain, Bersuker, Gennadi, Vogel, Eric M., Bernstein, Joseph B.

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Assessment of acceleration models used for BGA solder joint reliability studies von Yang, Liyu, Bernstein, Joseph B., Koschmieder, T.

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Hardware Error Likelihood Induced by the Operation of Software von Bing Huang, Rodriguez, M., Ming Li, Bernstein, J. B., Smidts, C. S.

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Experimental investigation of the optimal laser-induced microbridges von Chung, Kuan-Jung, Bernstein, Joseph B.

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Open Archive TOULOUSE Archive Ouverte (OATAO) Reliability prediction with MTOL von Bernstein, Joseph B, Bensoussan, Alain, Bender, Emmanuel, Bernstein, Joseph B

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Reliability of ultrathin silicon dioxide under combined substrate hot-electron and constant voltage tunneling stress von Vogel, E.M., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y., Bernstein, J.B.

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An improved reliability model for Si and GaN power FET von Golan, Gady, Azoulay, Moshe, Avraham, Tsuriel, Kremenetsky, Ilan, Bernstein, Joseph B.

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Nondestructive Quantitative Analysis of Crack Propagation in Solder Joints von Gershman, Israel, Bernstein, Joseph B.

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Analysis of energy process window of laser metal pad cut link structure von Joohan Lee, Bernstein, J.B.

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