Structural health monitoring of solder joints in QFN package von Gershman, I., Bernstein, J.B.

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Docetaxel as an alternative to paclitaxel after acute hypersensitivity reactions von Bernstein, BJ

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Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides von Suehle, J.S., Zhu, B., Chen, Y., Bernstein, J.B.

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Heavy-ion-induced soft breakdown of thin gate oxides von Conley, J.F., Suehle, J.S., Johnston, A.H., Wang, B., Miyahara, T., Vogel, E.M., Bernstein, J.B.

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Reliability prediction of FinFET FPGAs by MTOL von Bender, E., Bernstein, J.B., Bensoussan, A.

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Prevalence of complementary and alternative medicine use in cancer patients von Bernstein, B J, Grasso, T

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Successful Rechallenge with Etoposide Phosphate after an Acute Hypersensitivity Reaction to Etoposide von Bernstein, Bridget J., Troner, Michael B.

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The impact of lead-free soldering on electronics packages von Yang, L, Bernstein, J.B, Chung, K

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Economic and clinical impact of a pharmacy-based filgrastim protocol in oncology patients von Bernstein, BJ, Blanchard, LM

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Short-time failure of metal interconnect caused by current pulses von Murguia, J.E., Bernstein, J.B.

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Reliability of ultrathin silicon dioxide under combined substrate hot-electron and constant voltage tunneling stress von Vogel, E.M., Suehle, J.S., Edelstein, M.D., Wang, B., Chen, Y., Bernstein, J.B.

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THE EFFECT OF MULTIPLE LASER-PULSES ON DAMAGE TO THIN METALLIC-FILMS von COHEN, SS, BERNSTEIN, JB, WYATT, PW

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Demonstratives and reinforcers in Romance and Germanic languages von Bernstein, Judy B.

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Educating staff about pain management von Collins, P M, Auclair, M, Butler, E, Hush, M, Bernstein, B J, Aguirre, F, Huston, M, Pasero, C

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Impact of the trapping of anode hot holes on silicon dioxide breakdown von Vogel, E.M., Da-Wei Heh, Bernstein, J.B., Suehle, J.S.

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Failure dynamics of the IGBT during turn-off for unclamped inductive loading conditions von Chih-Chieh Shen, Hefner, A.R., Berning, D.W., Bernstein, J.B.

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Solder-Joint Quantitative Crack Analysis-Ohmic Resistance Approach von Gershman, I., Bernstein, J. B.

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Hardware Error Likelihood Induced by the Operation of Software von Bing Huang, Rodriguez, M., Ming Li, Bernstein, J. B., Smidts, C. S.

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The mechanism of laser-induced vertical links von COHEN, S. S, WYATT, P. W, BURNS, J. A, BERNSTEIN, J. B

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Laser energy limitation for buried metal cuts von Bernstein, J.B., Yijia Hua, Wei Zhang

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