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Reliability Testing of 3D-Printed Electromechanical Scanning Devices
Veröffentlicht in Journal of electronic testing
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Surrogate-Model-Based Analysis of Analog Circuits-Part I: Variability Analysis
Veröffentlicht in IEEE transactions on device and materials reliability
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Surrogate-Model-Based Analysis of Analog Circuits-Part II: Reliability Analysis
Veröffentlicht in IEEE transactions on device and materials reliability
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Demystifying Surrogate Modeling for Circuits and Systems
Veröffentlicht in IEEE circuits and systems magazine (New York, N.Y. 2001)
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Analog Negative-Bias-Temperature-Instability Monitoring Circuit
Veröffentlicht in IEEE transactions on device and materials reliability
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