Coupled stress-diffusion modelling of grain boundary segregation and dynamic embrittlement in a copper alloy von Benabou, L

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Predictions of compressive strength and kink band orientation for wood species von Benabou, L.

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Finite strain analysis of wood species under compressive failure due to kinking von Benabou, L.

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Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni von Tao, Q.B., Benabou, L., Nguyen Van, T.A., Nguyen-Xuan, H.

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A thermo-mechanical cohesive zone model for solder joint lifetime prediction von Benabou, L., Sun, Z., Dahoo, P.R.

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Metallurgical Phase Transformation and Behavior of Steels Under Impact Loading von Zerouki, M., Ouali, M. Ould, Benabou, L.

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Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints von Tao, Q.B., Benabou, L., Vivet, L., Le, V.N., Ouezdou, F.B.

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Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni von Tao, Q.B., Benabou, L., Le, V.N., Hwang, H., Luu, D.B.

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Methodology for DIC-based evaluation of the fracture behaviour of solder materials under monotonic and creep loadings von Benabou, L., Nguyen-Van, T.A., Tao, Q.B., Le, V.N., Ould Ouali, M., Nguyen-Xuan, H.

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Kink Band Formation in Wood Species Under Compressive Loading von Benabou, L.

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Investigation of the heel crack mechanism in Al connections for power electronics modules von Celnikier, Y., Benabou, L., Dupont, L., Coquery, G.

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Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy von Tao, Q.B., Benabou, L., Le, Van Nhat, Nguyen, Ngoc Anh Thi, Nguyen‐Xuan, Hung

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Analytical homogenization modeling and computational simulation of intergranular fracture in polycrystals von Benabou, L., Sun, Z.

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Numerical study of anisotropic failure in wood under large deformation von Benabou, L., Sun, Z.

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Modeling of the densification of silver particles during sintering at controlled pressure and temperature von Khiat, M N, Wang, X, Benabou, L, Chassagne, L, Linares, J

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Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling von Sun, Z., Benabou, L., Dahoo, P.R.

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Cardioneuroablation von Benabou, L., Duchateau, J., Amri, N., Maille, B.

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Lifetime prediction of a viscoplastic lead-free solder in power electronics modules under passive temperature cycling von Sun, Z., Benabou, L., Dahoo, P.

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Optimization of wire connections design for power electronics von Celnikier, Y., Dupont, L., Hervé, E., Coquery, G., Benabou, L.

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Continuum Damage Approach for Fatigue Life Prediction of Viscoplastic Solder Joints von Benabou, L., Sun, Z., Pougnet, P., Dahoo, P. R.

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