Variation-resilient quantifiable plasma process induced damage monitoring von Beckmeier, D., Martin, A.

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Plasma process induced damage detection by fast wafer level reliability monitoring for automotive applications von Beckmeier, D., Martin, A.

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Growth of highly textured aluminum films on LiTaO3 with optimized titanium intermediate layers von NÜSSL, R, SENFT, C, BECKMEIER, D, JEWULA, T, RUILE, W, SULIMA, T, HANSCH, W, EISELE, I

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Enhanced stress durability of nano resonators with scandium doped electrodes von Nüssl, R., Jewula, T., Binninger, C., Drozd, R., Ruile, W., Beckmeier, D., Sulima, T., Eisele, I., Hansch, W.

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Fast wafer level reliability monitoring as a tool to achieve automotive quality for a wafer process von Martin, A., Vollertsen, R.-P., Mitchell, A., Traving, M., Beckmeier, D., Nielen, H.

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Growth of highly textured aluminum films on LiTaO 3 with optimized titanium intermediate layers von Nüssl, R., Senft, C., Beckmeier, D., Jewula, T., Ruile, W., Sulima, T., Hansch, W., Eisele, I.

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