1100 × 1100 port MEMS-based optical crossconnect with 4-dB maximum loss von Kim, J, Nuzman, C.J, Kumar, B, Lieuwen, D.F, Kraus, J.S, Weiss, A, Lichtenwalner, C.P, Papazian, A.R, Frahm, R.E, Basavanhally, N.R, Ramsey, D.A, Aksyuk, V.A, Pardo, F, Simon, M.E, Lifton, V, Chan, H.B, Haueis, M, Gasparyan, A, Shea, H.R, Arney, S, Bolle, C.A, Kolodner, P.R, Ryf, R, Neilson, D.T, Gates, J.V

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Channel equalization and blocking filter utilizing microelectromechanical mirrors von Neilson, D.T., Tang, H., Greywall, D.S., Basavanhally, N.R., Ko, L., Ramsey, D.A., Weld, J.D., Low, Y.L., Pardo, F., Lopez, D.O., Busch, P., Prybyla, J., Haueis, M., Pai, C.S., Scotti, R., Ryf, R.

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1100 x 1100 port MEMS-based optical crossconnect with 4-dB maximum loss von Kim, J., Nuzman, C.J., Kumar, B., Lieuwen, D.F., Kraus, J.S., Weiss, A., Lichtenwalner, C.P., Papazian, A.R., Frahm, R.E., Basavanhally, N.R., Ramsey, D.A., Aksyuk, V.A., Pardo, F., Simon, M.E., Lifton, V., Chan, H.B., Haueis, M., Gasparyan, A., Shea, H.R., Arney, S., Bolle, C.A., Kolodner, P.R., Ryf, R., Neilson, D.T., Gates, J.V.

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MEMS thermal imager with optical readout von Jones, C.D.W., Bolle, C.A., Ryf, R., Simon, M.E., Pardo, F., Aksyuk, V.A., Lai, W.Y.-C., Bower, J.E., Miner, J.F., Klemens, F.P., Cirelli, R.A., Sorsch, T.W., Ferry, E.J., Fetter, L.A., Pai, C.-S., Taylor, J.A., Vyas, B., Watson, G.P., Stekas, B., Baker, M.R., Papazian, A.R., Basavanhally, N.R., Mansfield, W.M., Kornblit, A., Keller, R.C., Gates, J.V., Ramirez, A.P.

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256 x 256 port optical cross-connect subsystem von NEILSON, David T, FRAHM, R, AKSYUK, V. A, GATES, J. V, KOLODNER, Paul, BOLLE, C. A, RYF, Roland, KIM, J, PAPAZIAN, A. R, NUZMAN, C. J, GASPARYAN, A, BASAVANHALLY, N. R

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Compact 64 × 64 micromechanical optical cross connect von Kozhevnikov, M, Basavanhally, N.R, Weld, J.D, Low, Y.L, Kolodner, P, Bolle, C.A, Ryf, R, Papazian, A.R, Olkhovets, A, Pardo, F, Kim, J, Neilson, D.T, Aksyuk, V.A, Gates, J.V

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238 x 238 micromechanical optical cross connect von Aksyuk, V.A., Arney, S., Basavanhally, N.R., Bishop, D.J., Bolle, C.A., Chang, C.C., Frahm, R., Gasparyan, A., Gates, J.V., George, R., Giles, C.R., Kim, J., Kolodner, P.R., Lee, T.M., Neilson, D.T., Nijander, C., Nuzman, C.J., Paczkowski, M., Papazian, A.R., Pardo, F., Ramsey, D.A., Ryf, R., Scotti, R.E., Shea, H., Simon, M.E.

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Compact 64 x 64 micromechanical optical cross connect von Kozhevnikov, M., Basavanhally, N.R., Weld, J.D., Low, Y.L., Kolodner, P., Bolle, C.A., Ryf, R., Papazian, A.R., Olkhovets, A., Pardo, F., Kim, J., Neilson, D.T., Aksyuk, V.A., Gates, J.V.

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256×256 port optical cross-connect subsystem von Neilson, D.T, Frahm, R, Kolodner, P, Bolle, C.A, Ryf, R, Kim, J, Papazian, A.R, Nuzman, C.J, Gasparyan, A, Basavanhally, N.R, Aksyuk, V.A, Gates, J.V

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238×238 micromechanical optical cross connect von Aksyuk, V.A, Arney, S, Basavanhally, N.R, Bishop, D.J, Bolle, C.A, Chang, C.C, Frahm, R, Gasparyan, A, Gates, J.V, George, R, Giles, C.R, Kim, J, Kolodner, P.R, Lee, T.M, Neilson, D.T, Nijander, C, Nuzman, C.J, Paczkowski, M, Papazian, A.R, Pardo, F, Ramsey, D.A, Ryf, R, Scotti, R.E, Shea, H, Simon, M.E

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Wavelength-selective 1xK switches using free-space optics and MEMS micromirrors: theory, design, and implementation von Marom, D M, Neilson, D T, Greywall, D S, Chien-Shing Pai, Basavanhally, N R, Aksyuk, V A, Lopez, D O, Pardo, F, Simon, M E, Low, Y, Kolodner, P, Bolle, C A

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Wavelength-selective 1K switches using free-space optics and MEMS micromirrors: theory, design, and implementation von Marom, D M, Neilson, D T, Greywall, D S, Pai, Chien-Shing, Basavanhally, N R, Aksyuk, V A, Lopez, DO, Pardo, F, Simon, ME, Low, Y, Kolodner, P, Bolle, CA

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256x256 port optical cross-connect subsystem von Neilson, D T, Frahm, R, Kolodner, P, Bolle, C A, Ryf, R, Kim, J, Papazian, A R, Nuzman, C J, Gasparyan, A, Basavanhally, N R, Aksyuk, V A, Gates, J V

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238x238 micromechanical optical cross connect von Aksyuk, V A, Arney, S, Basavanhally, N R, Bishop, D J, Bolle, C A, Chang, C C, Frahm, R, Gasparyan, A, Gates, J V, George, R, Giles, C R, Kim, J, Kolodner, P R, Lee, T M, Neilson, D T, Nijander, C, Nuzman, C J, Paczkowski, M, Papazian, A R

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238238 micromechanical optical cross connect von Aksyuk, V A, Arney, S, Basavanhally, N R, Bishop, D J, Bolle, CA, Chang, C C, Frahm, R, Gasparyan, A, Gates, J V, George, R, Giles, C R, Kim, J, Kolodner, PR, Lee, T M, Neilson, D T, Nijander, C, Nuzman, C J, Paczkowski, M, Papazian, A R, Pardo, F, Ramsey, DA, Ryf, R, Scotti, R E, Shea, H, Simon, ME

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Optoelectronic packaging of two-dimensional surface active devices von Basavanhally, N.R., Brady, M.F., Buchholz, D.B.

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Direct chip interconnect with adhesive conductor films von Basavanhally, N.R., Chang, D.D., Cranston, B., Segar, S.G.

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High performance optical datalink array technology von Nordin, R.A., Buchholz, D.B., Huisman, R.F., Basavanhally, N.R., Levi, A.F.J.

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Flip chip repair process von Basavanhally, N.R., Gahr, S.A., Liu, J.J., Nguyen, M.N.

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Demonstration of distributed mesh restoration and auto-provisioning in a WDM network using a large optical cross-connect von Agrawal, N., Tentarelli, E.S., Jackman, N.A., Zhang, L., Korotky, S.K., Lee, B.H., Baroni, S., Comissiong, B.M., Hitchcock, J.M., Bing, Y.R., Hickey, J.P., Gottlieb, A.M., Bhalla, K.S., van Blarcum, T.W., Neilson, D.T., Giles, C.R., Aksyuk, V.A., Arney, S., Basavanhally, N.R., Bishop, D.J., Boie, B.A., Bolle, C.A., Gates, J.V., Kolodner, P.R., Pardo, F., Ruel, R., Scotti, R.E.

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