Rheological behavior of silver nanowire conductive inks during screen printing von Hemmati, Shohreh, Barkey, Dale P., Gupta, Nivedita

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Polyol Silver Nanowire Synthesis and the Outlook for a Green Process von Hemmati, Shohreh, Barkey, Dale P., Harris, Michael

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Parametric Study, Sensitivity Analysis, and Optimization of Polyol Synthesis of Silver Nanowires von Hemmati, Shohreh, Barkey, Dale P.

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High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking II. Reduced Electrodeposition Process Time von Kondo, Kazuo, Yonezawa, Toshihiro, Mikami, Daisuke, Okubo, Toshikazu, Taguchi, Yuichi, Takahashi, Kenji, Barkey, Dale P

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Corrosion of Steel Reinforcement in Concrete Adjacent to Surface Repairs von Barkey, Dale P

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On the Displacement of Adsorbed Polyethylene Glycol by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition von Kreider, Ashleigh, Barkey, Dale P., Wong, Edward H.

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Synthesis and Characterization of Silver Nanowire Suspensions for Printable Conductive Media von Hemmati, Shohreh, Barkey, Dale P., Gupta, Nivedita, Banfield, Ryan

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NMR Spectral Studies of Interactions Between the Accelerants SPS and MPS and Copper Chlorides von Garcia-Cardona, Elizabeth, Wong, Edward H., Barkey, Dale P.

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Silver Nanowire Synthesis in a Continuous Millifluidic Reactor von Hemmati, Shohreh, Barkey, Dale P., Eggleston, Lindsay, Zukas, Brian, Gupta, Nivedita, Harris, Michael

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High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking von Kondo, Kazuo, Yonezawa, Toshihiro, Mikami, Daisuke, Okubo, Toshikazu, Taguchi, Yuichi, Takahashi, Kenji, Barkey, Dale P.

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Surface Adsorption of PEG and Cl[sup −] Additives for Copper Damascene Electrodeposition von Jin, Ying, Kondo, Kazuo, Suzuki, Yosuke, Matsumoto, Toshiaki, Barkey, Dale P.

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Adsorption of Benzyl Viologen Dichloride and Its Displacement By 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition von Lu, Jing, Barkey, Dale P

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Treatment of anodized aluminum components von Barkey Dale P

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Electrocodeposition of Silver Particles with Tin for Fabrication of Lead-Free Solder Bumps von Barkey, Dale P., Wu, B., Keigler, Arthur, Liu, Zhenqui

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Treatment of Anodized Aluminum Components von BARKEY DALE P

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Roughness development in metal electrodeposition. II: Stability theory von BARKEY, D. P, MULLER, R. H, TOBIAS, C. W

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Roughness development in metal electrodeposition. I: Experimental results von BARKEY, D. P, MULLER, R. H, TOBIAS, C. W

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ELECTROCODEPOSITION OF LEAD FREE TIN ALLOYS von BARKEY, DALE P

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ELECTROCODEPOSITION OF LEAD FREE TIN ALLOYS von BARKEY, DALE P

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Electrocodeposition of lead free tin alloys von BARKEY DALE P

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