Control of nanosilver sintering attained through organic binder burnout von Bai, John G., Lei, Thomas G., Calata, Jesus N., Lu, Guo-Quan

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Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices von Bai, J.G., Calata, J.N., Guo-Quan Lu

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Nanostructured biosensing platform-shadow edge lithography for high-throughput nanofabrication von Bai, John G, Yeo, Woon-Hong, Chung, Jae-Hyun

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Shadow edge lithography for nanoscale patterning and manufacturing von Bai, John G, Chang, Cheng-Ling, Chung, Jae-Hyun, Lee, Kyong-Hoon

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Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing von Bai, John G, Creehan, Kevin D, Kuhn, Howard A

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Manipulation of nanoparticles and biomolecules by electric field and surface tension von Liu, Yaling, Oh, Kieseok, Bai, John G., Chang, Cheng-Ling, Yeo, Woonhoog, Chung, Jae-Hyun, Lee, Kyong-Hoon, Liu, Wing Kam

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Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability von Bai, John G, Calata, Jesus N, Lu, Guo-Quan

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Magneto-optical current sensing for applications in integrated power electronics modules von Bai, John G., Lu, Guo-Quan, Lin, Tao

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Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material von Bai, J.G., Zhiye Zach Zhang, Calata, J.N., Guo-Quan Lu

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Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite-a highly sensitive electric current and∕or vortex magnetic field sensor von Dong, Shuxiang, Bai, John G., Zhai, Junyi, Li, Jie-Fang, Lu, G.-Q., Viehland, D., Zhang, Shujun, Shrout, T. R.

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Strategies for improving the reliability of solder joints on power semiconductor devices von Lu, Guo-Quan, Liu, Xingsheng, Wen, Sihua, Noel Calata, Jesus, Bai, John G

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OPTICAL MODULE WITH DOUBLE EMITTER CHIPS AND DOUBLE DOVE PRISMS von BAI, John G

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SLOW AXIS, OR SLOW AXIS AND FAST AXIS, WAVELENGTH BEAM COMBINING FOR LASER MINIBARS von BAI, John G

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FAST AXIS WAVELENGTH BEAM COMBINING FOR BROAD AREA LASER DIODES von ROSSIN, Victor, BAI, John G

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Manipulation of nanoparticles and biomolecules by electric field and surface tension: Immersed Boundary Method and Its Extensions von YALING LIU, OH, Kieseok, BAI, John G, CHANG, Cheng-Ling, YEO, Woonhoog, CHUNG, Jae-Hyun, LEE, Kyong-Hoon, WING KAM LIU

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Flip-chip on flex integrated power electronics modules for high-density power integration von Bai, J.G., Guo-Quan Lu, Xingsheng Liu

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FLARED LASER DIODE ARRAY von ROSSIN, Victor, PETERS, Matthew Glenn, MUENDEL, Martin H, MOREHEAD, James J, BAI, John G

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LASER MODULE WITH BEAM ROTATOR von ROSSIN, Victor, WEI, Cailin, DU, Jihua, BAI, John G, YALAMANCHILI, Prasad

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MULTI-WAVELENGTH LASER DIODE von ROSSIN, Victor, MUENDEL, Martin H, MOREHEAD, James J, BAI, John G

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Three-dimensional packaging for power semiconductor devices and modules von Calata, J.N., Bai, J.G., Xingsheng Liu, Sihua Wen, Guo-Quan Lu

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