Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material von Bai, J.G., Zhiye Zach Zhang, Calata, J.N., Guo-Quan Lu

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Control of nanosilver sintering attained through organic binder burnout von Bai, John G., Lei, Thomas G., Calata, Jesus N., Lu, Guo-Quan

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Magneto-optical current sensing for applications in integrated power electronics modules von Bai, John G., Lu, Guo-Quan, Lin, Tao

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Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices von Bai, J.G., Calata, J.N., Guo-Quan Lu

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Nanostructured biosensing platform-shadow edge lithography for high-throughput nanofabrication von Bai, John G, Yeo, Woon-Hong, Chung, Jae-Hyun

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Shadow edge lithography for nanoscale patterning and manufacturing von Bai, John G, Chang, Cheng-Ling, Chung, Jae-Hyun, Lee, Kyong-Hoon

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Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability von Bai, John G, Calata, Jesus N, Lu, Guo-Quan

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Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing von Bai, John G, Creehan, Kevin D, Kuhn, Howard A

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Manipulation of nanoparticles and biomolecules by electric field and surface tension von Liu, Yaling, Oh, Kieseok, Bai, John G., Chang, Cheng-Ling, Yeo, Woonhoog, Chung, Jae-Hyun, Lee, Kyong-Hoon, Liu, Wing Kam

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Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite-a highly sensitive electric current and∕or vortex magnetic field sensor von Dong, Shuxiang, Bai, John G., Zhai, Junyi, Li, Jie-Fang, Lu, G.-Q., Viehland, D., Zhang, Shujun, Shrout, T. R.

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Three-dimensional packaging for power semiconductor devices and modules von Calata, J.N., Bai, J.G., Xingsheng Liu, Sihua Wen, Guo-Quan Lu

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Junctional delay, frequency, and direction-dependent uncoupling of human heterotypic Cx45/Cx43 gap junction channels von Ye, Willy G., Yue, Benny, Aoyama, Hiroshi, Kim, Nicholas K., Cameron, John A., Chen, Honghong, Bai, Donglin

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Strategies for improving the reliability of solder joints on power semiconductor devices von Lu, Guo-Quan, Liu, Xingsheng, Wen, Sihua, Noel Calata, Jesus, Bai, John G

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Comparability of neuraminidase inhibition antibody titers measured by enzyme-linked lectin assay (ELLA) for the analysis of influenza vaccine immunogenicity von Eichelberger, Maryna C, Couzens, Laura, Gao, Yonghong, Levine, Min, Katz, Jacqueline, Wagner, Ralf, Thompson, Catherine I, Höschler, Katja, Laurie, Karen, Bai, Tian, Engelhardt, Othmar G, Wood, John

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Flip-chip on flex integrated power electronics modules for high-density power integration von Bai, J.G., Guo-Quan Lu, Xingsheng Liu

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Towards an integrated phylogenetic classification of the Tremellomycetes von Liu, X.-Z., Wang, Q.-M., Göker, M., Groenewald, M., Kachalkin, A.V., Lumbsch, H.T., Millanes, A.M., Wedin, M., Yurkov, A.M., Boekhout, T., Bai, F.-Y.

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OPTICAL MODULE WITH DOUBLE EMITTER CHIPS AND DOUBLE DOVE PRISMS von BAI, John G

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SLOW AXIS, OR SLOW AXIS AND FAST AXIS, WAVELENGTH BEAM COMBINING FOR LASER MINIBARS von BAI, John G

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FAST AXIS WAVELENGTH BEAM COMBINING FOR BROAD AREA LASER DIODES von ROSSIN, Victor, BAI, John G

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Discovery of a midgut peptide hormone which activates the endocrine cascade leading to oögenesis in Phormia regina (Meigen) von Yin, Chih-Ming, Zou, Bai-Xiang, Li, Mei-Fang, Stoffolano, John G.

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