The double‐ring electrodynamic balance for microparticle characterization von Davis, E. James, Buehler, Mark F., Ward, Timothy L.

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Microparticle raman spectroscopy of multicomponent aerosols von Buehler, Mark F, Allen, Theresa M, Davis, E.James

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Radiometric effects on absorbing microspheres von Allen, Theresa M, Buehler, Mark F, Davis, E.James

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Separation of Monovalent Cations by Electrodialysis von NORTON, JOHN D., BUEHLER, MARK F.

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In-situ monitoring of electrochemical transport processes in Hanford Grout Vault Soil von Schwartz, Daniel T., Buehler, Mark F., Christiansen, Derek X., Davis, E.James

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A study of gas/aerosol chemical reactions by microdroplet Raman spectroscopy: The bromine/1-octadecene reaction von Buehler, Mark F., Davis, E.James

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Composition and a method for defect reduction von BUEHLER MARK F

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Method for defect reduction von Buehler, Mark F

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Method for defect reduction von BUEHLER MARK F

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ABRASIVE WITH A MODIFIED SURFACE AND A METHOD FOR MAKING IT von BUEHLER MARK F

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Abrasive with a modified surface and a method for making it von Buehler, Mark F

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Method for defect reduction von BUEHLER MARK F

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Method for defect reduction von Buehler, Mark F

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Method for defect reduction von BUEHLER MARK F

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COMPOSITION AND A METHOD FOR DEFECT REDUCTION von BUEHLER MARK F

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Metallization layer of an interconnect structure for a semiconductor die, method of fabricating the metallization layer, integrated circuit structure comprising the metallization l... von KANDAS, ANGELO W, HARAN, MOHIT K, DAS, RITESH K, SRIDHAR, DEEPAK, LIM, CHUL-HYUN, KIRBY, STEVEN D, TAN, ELLIOT N, BHIMARASETTI, GOPINATH, GULER, LEONARD P, TRIBATHI, ABHINAV, PARKER, JASON M, BELL, MARIE JUSTINE, PRINCE, MATTHEW J, GRANADOS ALPIZAR, BERNAL, ASORO, MICHAEL A, BUEHLER, MARK F, YEOH, ANDREW W, HARPER, MICHAEL K

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APPROACHES FOR PATTERNING METAL LINE ENDS FOR BACK END OF LINE (BEOL) INTERCONNECTS von LIM, Chul-Hyun, PARKER, Jason, M, HARPER, Michael, K, BUEHLER, Mark, F, GULER, Leonard, P, TRIBATHI, Abhinav, PRINCE, Matthew, J, SRIDHAR, Deepak, YEOH, Andrew, W, HARAN, Mohit, K, ASORO, Michael, A, BELL, Marie Justine, GRANADOS ALPIZAR, Bernal, BHIMARASETTI, Gopinath, KANDAS, Angelo, W, TAN, Elliot, N, KIRBY, Steven, D, DAS, Ritesh, K

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Metallizationlayer of an interconnct structure for a semiconductor die,method of fabricating the metallization layer,integrated circuit structure comprising the metallization layer... von KANDAS, ANGELO W, HARAN, MOHIT K, DAS, RITESH K, SRIDHAR, DEEPAK, LIM, CHUL-HYUN, KIRBY, STEVEN D, TAN, ELLIOT N, BHIMARASETTI, GOPINATH, GULER, LEONARD P, TRIBATHI, ABHINAV, PARKER, JASON M, BELL, MARIE JUSTINE, PRINCE, MATTHEW J, GRANADOS ALPIZAR, BERNAL, ASORO, MICHAEL A, BUEHLER, MARK F, YEOH, ANDREW W, HARPER, MICHAEL K

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Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface von BUEHLER MARK F, FREDRICKSON LARRY R

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Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface von Buehler, Mark F, Fredrickson, Larry R

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