THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES von Iruvanti, Sushumna, Hu, Yuanchen, Buchling Rego, Philipp K

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Tamper-respondent assemblies with pressure connector assemblies von Brodsky, William L, Campbell, Levi, Long, David Clifford, Higby, Arthur J, Buchling Rego, Philipp K, Busby, James

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Tamper-respondent assemblies with porous heat transfer element(s) von Campbell, Levi, Higby, Arthur J, Bunt, Jay A, Buchling Rego, Philipp K, Zhang, Hongqing, Lewison, David J, Busby, James

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Cryptographic hardware security module with secure embedded heat pipe von Campbell, Levi, Cohen, Edward N, Santiago-Fernandez, William, Long, David Clifford, Higby, Arthur J, Doyle, Matthew, Buchling Rego, Philipp K, Dangler, John R, Busby, James

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TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES von Santiago-Fernandez, William, Higby, Arthur J, Budd, Russell A, Boston, Lauren, Buchling Rego, Philipp K, LONG, DAVID CLIFFORD, Dangler, John R, Busby, James, Wendling, Hannah

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TAMPER-RESPONDENT ASSEMBLIES WITH PRESSURE CONNECTOR ASSEMBLIES von LONG, David Clifford, HIGBY, Arthur J, BRODSKY, William L, BUSBY, James, BUCHLING REGO, Philipp K, CAMPBELL, Levi

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Dielectric material change to optimize electrical and mechanical properties of flex circuit von James Busby, Arthur J Higby, David Clifford Long, William Santiago-Fernandez, Edward N Cohen, John R Dangler, Matthew Doyle, Philipp K Buchling Rego, Michael Fisher

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TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S) von HIGBY, Arthur J, BUSBY, James, LEWISON, David J, BUCHLING REGO, Philipp K, BUNT, Jay A, ZHANG, Hongqing, CAMPBELL, Levi

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CRYPTOGRAPHIC HARDWARE SECURITY MODULE WITH SECURE EMBEDDED HEAT PIPE von Cohen, Edward N, Santiago-Fernandez, William, Higby, Arthur J, Doyle, Matthew, Buchling Rego, Philipp K, LONG, DAVID CLIFFORD, Dangler, John R, CAMPBELL, Levi, Busby, James

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CRYPTOGRAPHIC HARDWARE SECURITY MODULE WITH SECURE EMBEDDED HEAT PIPE von COHEN, Edward N, LONG, David Clifford, HIGBY, Arthur J, SANTIAGO-FERNANDEZ, William, BUSBY, James, BUCHLING REGO, Philipp K, DOYLE, Matthew, DANGLER, John R, CAMPBELL, Levi

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Dielectric material change to optimize electrical and mechanical properties of flex circuit von Cohen, Edward N, Santiago-Fernandez, William, Long, David Clifford, Higby, Arthur J, Doyle, Matthew, Fisher, Michael, Buchling Rego, Philipp K, Dangler, John R, Busby, James

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DIELECTRIC MATERIAL CHANGE TO OPTIMIZE ELECTRICAL AND MECHANICAL PROPERTIES OF FLEX CIRCUIT von DOYLE, MATTHEW, Cohen, Edward N, Santiago-Fernandez, William, Higby, Arthur J, Buchling Rego, Philipp K, Dangler, John R, LONG, DAVID CLIFFORD, Busby, James, FISHER, MICHAEL

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WECHSEL DES DIELEKTRISCHEN MATERIALS ZUM OPTIMIEREN DER ELEKTRISCHEN UND MECHANISCHEN EIGENSCHAFTEN EINER FLEXIBLEN SCHALTUNG von Cohen, Edward N, Santiago-Fernandez, William, Long, David Clifford, Higby, Arthur J, Doyle, Matthew, Fisher, Michael, Buchling Rego, Philipp K, Dangler, John R, Busby, James

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WECHSEL DES DIELEKTRISCHEN MATERIALS ZUM OPTIMIEREN DER ELEKTRISCHEN UND MECHANISCHEN EIGENSCHAFTEN EINER FLEXIBLEN SCHALTUNG von Cohen, Edward N, Santiago-Fernandez, William, Long, David Clifford, Higby, Arthur J, Doyle, Matthew, Fisher, Michael, Buchling Rego, Philipp K, Dangler, John R, Busby, James

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TAMPER-RESPONDENT ASSEMBLY AND METHOD OF MANUFACTURING TAMPER-RESPONDENT ASSEMBLY (TAMPER-RESPONDENT ASSEMBLY WITH STRUCTURAL MATERIAL WITHIN SEALED INNER COMPARTMENT) von LI JUNJUN, LEVI CAMPBELL, ARTHUR J HIGBY, PHILIPP K BUCHLING REGO, JAY A BUNT, ZHANG HONGQING, DAVID J LEWISON, LIAN GUODA, LI SHIDONG, SONG ZHIGANG, JAMES BUSBY

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