Impact of Cu+ and Cu2+ species on the oxide-metal transition processes of CuxO foams during the CO2RR probed by operando Quick-XAS von Blaseio, S, Dosche, C, Rahaman, M, Kiran, K, Dworzak, A, Mahrt, B, Broekmann, P, Dutta, A, Oezaslan, M

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Classification of suppressor additives based on synergistic and antagonistic ensemble effects von Broekmann, P., Fluegel, A., Emnet, C., Arnold, M., Roeger-Goepfert, C., Wagner, A., Hai, N.T.M., Mayer, D.

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Interfacial electron transfer between Geobacter sulfurreducens and gold electrodes via carboxylate-alkanethiol linkers: Effects of the linker length von Füeg, M., Borjas, Z., Estevez-Canales, M., Esteve-Núñez, A., Pobelov, I.V., Broekmann, P., Kuzume, A.

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Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry von Cedeño López, A, Grimaudo, V, Riedo, A, Tulej, M, Wiesendanger, R, Lukmanov, R, Moreno-García, P, Lörtscher, E, Wurz, P, Broekmann, P

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Characterization of femtosecond laser ablation processes on as-deposited SnAg solder alloy using laser ablation ionization mass spectrometry von López, A. Cedeño, Grimaudo, V., Riedo, A., Tulej, M., Wiesendanger, R., Lukmanov, R., Moreno-García, P., Lörtscher, E., Wurz, P., Broekmann, P.

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Copolymers of Imidazole and 1,4-Butandiol Diglycidyl Ether as an Efficient Suppressor Additive for Copper Electroplating von Hai, N. T. M., Furrer, J., Barletta, E., Luedi, N., Broekmann, P.

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Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM von Huynh, T. M. T., Hai, N. T. M., Broekmann, P.

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Electrochemical control of a non-covalent binding between ferrocene and beta-cyclodextrin von Kolivoška, V, Mohos, M, Pobelov, I V, Rohrbach, S, Yoshida, K, Hong, W J, Fu, Y C, Moreno-García, P, Mészáros, G, Broekmann, P, Hromadová, M, Sokolová, R, Valášek, M, Wandlowski, Th

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Structural analysis of wheat wax (Triticum aestivum, c.v. 'Naturastar' L.): from the molecular level to three dimensional crystals von Koch, K, Barthlott, W, Koch, S, Hommes, A, Wandelt, K, Mamdouh, W, De-Feyter, S, Broekmann, P

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Towards femtosecond laser ablation ionization mass spectrometric approaches for chemical depth-profiling analysis of lead-free Sn solder bumps with minimized side-wall contribution... von Cedeño López, A, Grimaudo, V, Moreno-García, P, Riedo, A, Tulej, M, Wiesendanger, R, Wurz, P, Broekmann, P

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High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures von Riedo, A, Grimaudo, V, Moreno-García, P, Neuland, M. B, Tulej, M, Wurz, P, Broekmann, P

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Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating von Hai, N.T.M., Huynh, T.T.M., Fluegel, A., Arnold, M., Mayer, D., Reckien, W., Bredow, T., Broekmann, P.

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Formation of Supramolecular Cavitands on Copper Electrode Surfaces von Safarowsky, C, Wandelt, K, Broekmann, P

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From Structure to Function: Characterization of Cu(I) Adducts in Leveler Additives by DFT Calculations von Simona, F, Hai, N. T. M, Broekmann, P, Cascella, M

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Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies von Hai, N.T.M., Huynh, T.M.T., Fluegel, A., Mayer, D., Broekmann, P.

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In-situ STM investigation of specific anion adsorption on Cu(111) von Broekmann, P., Wilms, M., Kruft, M., Stuhlmann, C., Wandelt, K.

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In-situ STM investigation of adsorbate structures on Cu(111) in sulfuric acid electrolyte von Wilms, M., Broekmann, P., Stuhlmann, C., Wandelt, K.

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Potential dependent adlayer structures of a sulfur-covered Au(1 1 1) electrode in alkaline solution: An in situ STM study von Schlaup, C., Friebel, D., Broekmann, P., Wandelt, K.

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Phase transition in ordered porphyrin layers on iodide modified Cu(1 1 1): An EC-STM study von Hai, N.T.M., Gasparovic, B., Wandelt, K., Broekmann, P.

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Impact of Cu + and Cu 2+ species on the oxide-metal transition processes of Cu x O foams during the CO 2 RR probed by operando Quick-XAS von Blaseio, S., Dosche, C., Rahaman, M., Kiran, K., Dworzak, A., Mahrt, B., Broekmann, P., Dutta, A., Oezaslan, M.

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