Process Window Centering for 22 nm Lithography von Buengener, Ralf, Boye, Carol, Rhoads, Bryan N, Chong, Sang Y, Tejwani, Charu, Burns, Sean D, Stamper, Andrew D, Nafisi, Kourosh, Brodsky, Colin J, Fan, Susan S, Kini, Sumanth, Hahn, Roland

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157 nm Resist Materials: A Progress Report von Chiba, Takashi, Hung, Raymond J., Yamada, Shintaro, Trinque, Brian, Yamachika, Miko, Brodsky, Colin, Patterson, Kyle, Heyden, Anthony Vander, Jamison, Andrew, Lin, Shang-Ho, Somervell, Mark, Byers, Jeffrey, Conley, Will, Willson, C. Grant

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Effects of Preparative and Supercritical Drying Parameters on the Physical Properties of Niobia Aerogels von Brodsky, Colin J, Ko, Edmond I

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Effect of drying temperature on the physical properties of titania aerogels von BRODSKY, C. J, KO, E. I

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Process Window Centering for 22 nm lithography von Buengener, Ralf, Boye, C, Rhoads, B N, Chong, S Y, Tejwani, C, Burns, S D, Stamper, A D, Nafisi, K, Brodsky, C J, Fan, S S, Kini, S, Hahn, R

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Strategies for single patterning of contacts for 32nm and 28nm technology von Morgenfeld, B., Stobert, I., Haffner, H., An, J., Kanai, H., Ostermayr, M., Chen, N., Aminpur, M., Brodsky, C., Thomas, A.

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System and method for detection and prevention of influx of airborne contaminants von BRODSKY COLIN

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System and method for detection and prevention of influx of airborne contaminants von Brodsky, Colin

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SYSTEM AND METHOD FOR DETECTION AND PREVENTION OF INFLUX OF AIRBORNE CONTAMINANTS von BRODSKY COLIN

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157 nm resist materials: Progress report von Brodsky, Colin, Byers, Jeff, Conley, Will, Hung, Raymond, Yamada, Shintaro, Patterson, Kyle, Somervell, Mark, Trinque, Brian, Tran, H. V., Cho, Sungseo, Chiba, Takashi, Lin, Shang-Ho, Jamieson, Andrew, Johnson, Heather, Vander Heyden, Tony, Willson, C. Grant

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Effect of supercritical drying temperature on the properties of zirconia, niobia and titania-silica aerogels von Brodsky, Colin J., Ko, Edmond I.

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Tapered edge bead removal process for immersion lithography von BRODSKY COLIN J

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Tapered edge bead removal process for immersion lithography von Brodsky, Colin J

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TAPERED EDGE BEAD REMOVAL PROCESS FOR IMMERSION LITHOGRAPHY von BRODSKY COLIN J

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Method for post lithographic critical dimension shrinking using post overcoat planarization von BRODSKY COLIN J

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Method for post lithographic critical dimension shrinking using post overcoat planarization von Brodsky, Colin J

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Method of inspecting integrated circuits during fabrication von BRODSKY COLIN J, BRODSKY MARYJANE

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Method of inspecting integrated circuits during fabrication von Brodsky, Colin J, Brodsky, MaryJane

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SUBSTRATE PLANARIZATION WITH IMPRINT MATERIALS AND PROCESSES von BRODSKY, COLIN, BURNS, SEAN, BURNS, RYAN

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METHOD OF INSPECTING INTEGRATED CIRCUITS DURING FABRICATION von BRODSKY COLIN J, BRODSKY MARYJANE

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