Surface micromachined metallic microneedles von Chandrasekaran, S., Brazzle, J.D., Frazier, A.B.

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Solution hardened platinum alloy flexure materials for improved performance and reliability of MEMS devices von Brazzle, John D, Taylor, William P, Ganesh, Bala, Price, James J, Bernstein, Jonathan J

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A high fill factor linear mirror array for a wavelength selective switch von Taylor, William P, Brazzle, John D, Osenar, Amy Bowman, Corcoran, Christopher J, Jafri, Ijaz H, Keating, Daniel, Kirkos, Gregory, Lockwood, Matthew, Pareek, Ajay, Bernstein, Jonathan J

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Magnet arrays for use in a 3-D MEMS mirror array for optical switching von Taylor, W.P., Bernstein, J.J., Brazzle, J.D., Corcoran, C.J.

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Hollow Metallic Micromachined Needle Arrays von Brazzle, John D, Papautsky, Ian, A. Bruno Frazier

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Electromagnetically actuated mirror arrays for use in 3-D optical switching applications von Bernstein, J.J., Taylor, W.P., Brazzle, J.D., Corcoran, C.J., Kirkos, G., Odhner, J.E., Pareek, A., Waelti, M., Zai, M.

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Stacked circuit package with molded base having laser drilled openings for upper package von Ying, Yucheng, Beville, Frederick E, Ng, David R, Brazzle, John D, Anderson, Michael J

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Electronic module for high power applications von Ying, Yucheng, Kutlu, Zafer S, Beville, Frederick E, Brazzle, John D

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STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE von Ying, Yucheng, Beville, Frederick E, Ng, David R, Brazzle, John D, Anderson, Michael J

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ELECTRONIC MODULE FOR HIGH POWER APPLICATIONS von Ying, Yucheng, Kutlu, Zafer S, Beville, Frederick E, Brazzle, John D

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Stacked circuit package with molded base having laser drilled openings for upper package von Ying, Yucheng, Beville, Frederick E, Ng, David R, Brazzle, John D, Anderson, Michael J

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STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE von NG, David R, BRAZZLE, John D, BEVILLE, Frederick E, YING, Yucheng, ANDERSON, Michael J

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STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE von Ying, Yucheng, Beville, Frederick E, Ng, David R, Brazzle, John D, Anderson, Michael J

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Stacked circuit package with molded base having laser drilled openings for upper package von YING, YUCHENG, ANDERSON, MICHAEL J, BEVILLE, FREDERICK E, NG, DAVID R, BRAZZLE, JOHN D

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상부 패키지를 위한 레이저 천공 개구를 갖는 몰딩된 베이스가 있는 적층 회로 패키지 von BEVILLE FREDERICK E, ANDERSON MICHAEL J, NG DAVID R, BRAZZLE JOHN D, YING YUCHENG

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STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE von BEVILLE FREDERICK E, ANDERSON MICHAEL J, NG DAVID R, BRAZZLE JOHN D, YING YUCHENG

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Stacked circuit package with molded base having laser drilled openings for upper package von ANDERSON, MICHAEL J, BEVILLE, FREDERICK E, NG, DAVID R, BRAZZLE, JOHN D, YING, YUNG

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Surface micromachined microneedles von FRAZIER A. BRUNO, BRAZZLE JOHN D

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Surface micromachined microneedles von Frazier, A. Bruno, Brazzle, John D

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DUAL-AXIS TILT ACUATOR FOR MICROMIRROR ARRAY von BERNSTEIN, JONATHAN, TAYLOR, WILLIAM, BRAZZLE, JOHN, D

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