Surface micromachined metallic microneedles von Chandrasekaran, S., Brazzle, J.D., Frazier, A.B.

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Solution hardened platinum alloy flexure materials for improved performance and reliability of MEMS devices von Brazzle, John D, Taylor, William P, Ganesh, Bala, Price, James J, Bernstein, Jonathan J

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A high fill factor linear mirror array for a wavelength selective switch von Taylor, William P, Brazzle, John D, Osenar, Amy Bowman, Corcoran, Christopher J, Jafri, Ijaz H, Keating, Daniel, Kirkos, Gregory, Lockwood, Matthew, Pareek, Ajay, Bernstein, Jonathan J

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Magnet arrays for use in a 3-D MEMS mirror array for optical switching von Taylor, W.P., Bernstein, J.J., Brazzle, J.D., Corcoran, C.J.

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Hollow Metallic Micromachined Needle Arrays von Brazzle, John D, Papautsky, Ian, A. Bruno Frazier

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Laminar fluid behavior in microchannels using micropolar fluid theory von Papautsky, Ian, Brazzle, John, Ameel, Timothy, Frazier, A.Bruno

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Electromagnetically actuated mirror arrays for use in 3-D optical switching applications von Bernstein, J.J., Taylor, W.P., Brazzle, J.D., Corcoran, C.J., Kirkos, G., Odhner, J.E., Pareek, A., Waelti, M., Zai, M.

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Electronic component von Chew, Sok Mun, Brazzle, John David

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ELECTRONIC COMPONENT von BRAZZLE, John, CHEW, Sok Mun

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ELECTRONIC COMPONENT von BRAZZLE, John, CHEW, Sok Mun

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ELECTRONIC COMPONENT von Chew, Sok Mun, Brazzle, John

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ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE von Brazzle, John David, Nava, Melvin Sto Domingo, Pham, Hien Minh

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LOW PROFILE COUPLED INDUCTOR von Serpa, George Anthony, Brazzle, John David, Hawley, Steve, Yang, Jim

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A low-temperature IC-compatible process for fabricating surface-micromachined metallic microchannels von Papautsky, I., Brazzle, J., Swerdlow, H., Frazier, A.B.

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Three-dimensional packaging techniques for power FET density improvement von Brazzle, John David, Kutlu, Zafer, Wu, Albert M

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Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits von Brazzle, John David, Pruitt, David A, Beville, Frederick E

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Stacked circuit package with molded base having laser drilled openings for upper package von Ying, Yucheng, Beville, Frederick E, Ng, David R, Brazzle, John D, Anderson, Michael J

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MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS von BEVILLE, Frederick E, PRUITT, David A, BRAZZLE, John David

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Electronic module for high power applications von Ying, Yucheng, Kutlu, Zafer S, Beville, Frederick E, Brazzle, John D

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THREE-DIMENSIONAL PACKAGING TECHNIQUES FOR POWER FET DENSITY IMPROVEMENT von Brazzle, John David, Kutlu, Zafer, Wu, Albert M

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