Test challenges for 3D integration (an invited paper for CICC 2011) von Bottoms, W. R.

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Growth and Defect Structure of Lamellar Gold Microcrystals von Morriss, R. H., Bottoms, W. R., Peacock, R. G.

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Beyond Moore's Law von Bottoms, W R

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Correlation of electronic, leed, and auger diagnostics on ZnO surfaces von Levine, Jules D., Willis, A., Bottoms, W.R., Mark, Peter

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Chemisorption Reactions on High Index ZnS Surfaces von Bottoms, W. R., Lidow, D. B.

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The influence of surface structure on the chemisorption of oxygen by CdS single crystals von Baidyaroy, S., Bottoms, W.R., Mark, Peter

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Photodesorption from CdS von Baidyaroy, S., Bottoms, W.R., Mark, Peter

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Good things in small packages von Apte, P, Bottoms, W R, Chen, W, Scalise, G

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Ambient-sensitive semiconductivity of lead iodide crystals von Baidyaroy, S., Bottoms, W.R., Mark, P.

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HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES von MODLIN DOUGLAS, CHONG FU CHIUNG, MOK SAMMY, BOTTOMS W. R

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FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD von MCGEE ELAINE, DINAN THOMAS E, BOTTOMS W. R, MILTER ROMAN L, CHONG FU C

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High density interconnect system for IC packages and interconnect assemblies von MODLIN DOUGLAS, MOK SAMMY, BOTTOMS W. R, CHONG FU C

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A drip alarm von BOTTOMS, R W

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Preface von Bottoms, W. R., Wernick, J. H.

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Electronic states of free surfaces von Mark, Peter, Bottoms, W.R.

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CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES von MILTER, ROMAN, L, LI, SHA, CHONG, FU, CHIUNG, BOTTOMS, W. R, CHIEH, ERH-KONG, LITZA, ANNA, MCKAY, DOUGLAS, L

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FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE AND METHOD von GIAUQUE, PIERRE, H, DOAN, DAVID, THANH, MODLIN, DOUGLAS, N, BOTTOMS, W., R, MCGEE, ELAINE, CHONG, FU, CHIUNG, CHIEH, ERH-KONG, DINAN, THOMAS, EDWARD, MILTER, ROMAN

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FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE AND METHOD von GIAUQUE, PIERRE, H, DOAN, DAVID, THANH, MODLIN, DOUGLAS, N, BOTTOMS, W., R, MCGEE, ELAINE, CHONG, FU, CHIUNG, CHIEH, ERH-KONG, DINAN, THOMAS, EDWARD, MILTER, ROMAN

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CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES von MILTER, ROMAN, L, LI, SHA, CHONG, FU, CHIUNG, BOTTOMS, W. R, CHIEH, ERH-KONG, LITZA, ANNA, MCKAY, DOUGLAS, L

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FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE AND METHOD von GIAUQUE, PIERRE, H, DOAN, DAVID, THANH, MODLIN, DOUGLAS, N, BOTTOMS, W., R, MCGEE, ELAINE, CHONG, FU, CHIUNG, CHIEH, ERH-KONG, DINAN, THOMAS, EDWARD, MILTER, ROMAN

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