Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle von Sippel, Marcel, Tan, Yi Fong, Schmidt, Ralf, Botazzoli, Pietro, Sprenger, Mario, Franke, Jörg

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Extension and validation of the TRANSURANUS burn-up model for helium production in high burn-up LWR fuels von Botazzoli, Pietro, Luzzi, Lelio, Brémier, Stephane, Schubert, Arndt, Uffelen, Paul Van, Walker, Clive T., Haeck, Wim, Goll, Wolfgang

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Power module having at least two power semiconductor arrangements that are contacted on a substrate von Gospos, Robert, Zeyss, Felix, Höhne, Silvio, Namyslo, Lutz, Kürten, Bernd, Botazzoli, Pietro, Endres, Michael

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POWER MODULE HAVING AT LEAST TWO POWER SEMICONDUCTOR ARRANGEMENTS THAT ARE CONTACTED ON A SUBSTRATE von GOSPOS, ROBERT, BOTAZZOLI, PIETRO, ENDRES, MICHAEL, NAMYSLO, LUTZ, KÜRTEN, BERND, ZEYSS, FELIX, HÖHNE, SILVIO

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POWER MODULE WITH AT LEAST TWO POWER SEMICONDUCTOR ASSEMBLIES CONTACTED ON A SUBSTRATE von Gospos, Robert, Höhne, Silvio, Zeyß, Felix, Namyslo, Lutz, Kürten, Bernd, Botazzoli, Pietro, Endres, Michael

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POWER MODULE WITH AT LEAST TWO POWER SEMICONDUCTOR ASSEMBLIES CONTACTED ON A SUBSTRATE von ZEYSS FELIX, NAMYSLO LUTZ, GOSPOS ROBERT, KURTEN BERND, BOTAZZOLI PIETRO, ENDRES MICHAEL, HOHNE SILVIO

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